PMEG2010AEJ NXP Semiconductors, PMEG2010AEJ Datasheet - Page 5

• Manufacturer Part Number: PMEG2010AEJ
• Description: Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection, encapsulated in a SOD323F (SC-90) verysmall and flat lead Surface Mounted Device (SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
8. Package outline
9. Packing information
10. Soldering
PMEG2010AEJ_3
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
PMEG2010AEJ
Fig 4.
Fig 5.
For further information and the availability of packing methods, see
Package outline SOD323F (SC-90)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD323F (SC-90)
1.65
Packing methods
0.95
Package
SOD323F
Dimensions in mm
Rev. 03 — 15 January 2010
0.50
(2×)
2.7
2.3
1.8
1.6
3.05
2.80
2.10
1.60
Description
4 mm pitch, 8 mm tape and reel
20 V, 1 A very low V
1.35
1.15
1
2
0.40
0.25
0.50
001aab169
0.60
0.5
0.3
F
MEGA Schottky barrier rectifier
PMEG2010AEJ
Section
0.80
0.65
0.25
0.10
[1]
04-09-13
14.
Packing quantity
3000
-115
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2010. All rights reserved.
10000
-135
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