PMEG2010EPK NXP Semiconductors, PMEG2010EPK Datasheet

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 Surface-Mounted Device (SMD) plastic package with visible and solderab

PMEG2010EPK

Manufacturer Part Number
PMEG2010EPK
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 Surface-Mounted Device (SMD) plastic package with visible and solderab
Manufacturer
NXP Semiconductors
Datasheet
1. Product profile
Table 1.
[1]
Symbol
I
V
V
I
F(AV)
R
R
F
Device mounted on a ceramic Printed-Circuit Board (PCB), Al
Quick reference data
Parameter
average forward
current
reverse voltage
forward voltage
reverse current
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a leadless ultra small
SOD1608 Surface-Mounted Device (SMD) plastic package with visible and solderable
side pads.
PMEG2010EPK
20 V, 1 A low VF MEGA Schottky barrier rectifier
Rev. 1 — 20 January 2012
Average forward current: I
Reverse voltage: V
Low forward voltage V
Low reverse current
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
LED backlight for mobile application
Conditions
square wave; δ = 0.5; f = 20 kHz;
T
square wave; δ = 0.5; f = 20 kHz;
T
T
I
T
V
F
amb
sp
j
j
R
= 1 A; pulsed; t
= 25 °C
= 25 °C
= 10 V; T
≤ 135 °C
≤ 110 °C
R
≤ 20 V
F
j
= 25 °C
≤ 415 mV
F(AV)
2
p
O
≤ 300 µs; δ ≤ 0.02;
3
, standard footprint.
≤ 1 A
AEC-Q101 qualified
Solderable side pads
Package height typ. 0.37 mm
Ultra small and leadless SMD plastic
package
Low power consumption applications
Ultra high-speed switching
Reverse polarity protection
[1]
Min
-
-
-
-
-
Product data sheet
Typ
-
-
-
370
50
Max
1
1
20
415
250
Unit
A
A
V
mV
µA

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PMEG2010EPK Summary of contents

Page 1

... PMEG2010EPK low VF MEGA Schottky barrier rectifier Rev. 1 — 20 January 2012 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a leadless ultra small SOD1608 Surface-Mounted Device (SMD) plastic package with visible and solderable side pads ...

Page 2

... SOD1608 Description Leadless ultra small plastic package; 2 terminals Marking code 0100 0000 Figure 1. READING DIRECTION READING DIRECTION All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK Graphic symbol 1 2 sym001 Version SOD1608 [1] MARKING CODE (EXAMPLE) 006aac909 © NXP B.V. 2012. All rights reserved. ...

Page 3

... T p ≤ 25 °C T amb O , standard footprint Conditions in free air O , standard footprint All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK Min Max - [ ° j(init) [2][3] - 410 ...

Page 4

... Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PMEG2010EPK Product data sheet low VF MEGA Schottky barrier rectifier - All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK 006aac952 (s) p 006aac953 ...

Page 5

... ° MHz ° MHz ° All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK 006aac954 (s) p Min Typ Max - 240 280 - 310 350 - ...

Page 6

... V ( (1) δ = 0.1 (2) δ = 0.2 (3) δ = 0.5 (4) δ Fig 8. Average forward power dissipation as a function of average forward current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK 006aac956 (1) (2) (3) ( 125 ° ° ° − ...

Page 7

... I F(AV) (A) 1.0 0.5 0.0 125 150 175 T (°C) amb 2 Fig 12. Average forward current as a function of All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK (1) (2) (3) ( 100 125 T amb FR4 PCB, standard footprint T = 150 °C j (1) δ (DC) (2) δ ...

Page 8

... P duty cycle δ × √δ with I at DC, and F(AV) RMS M All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK low VF MEGA Schottky barrier rectifier 006aac963 125 150 175 T (° 006aac658 × ...

Page 9

... Product data sheet low VF MEGA Schottky barrier rectifier 0.85 0.75 0.80 0.72 1.65 1.55 0.40 0.32 2 0.75 0.67 Dimensions in mm 1.15 1.05 0.95 0.8 0.7 1 1.8 1.9 2.0 solder land plus solder paste solder resist Dimensions in mm All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK 0.40 0.34 0.04 11-11-21 0.75 0.65 0.55 0.7 0.8 0.9 2 0.1 0.2 SOD1608 sod1608_fr © NXP B.V. 2012. All rights reserved ...

Page 10

... NXP Semiconductors 11. Revision history Table 8. Revision history Document ID Release date PMEG2010EPK v.1 20120120 PMEG2010EPK Product data sheet low VF MEGA Schottky barrier rectifier Data sheet status Change notice Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 ...

Page 11

... Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK © NXP B.V. 2012. All rights reserved ...

Page 12

... TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 1 — 20 January 2012 PMEG2010EPK © NXP B.V. 2012. All rights reserved ...

Page 13

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 20 January 2012 Document identifier: PMEG2010EPK ...

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