PMEG2015EH_EJ NXP Semiconductors, PMEG2015EH_EJ Datasheet
PMEG2015EH_EJ
Related parts for PMEG2015EH_EJ
PMEG2015EH_EJ Summary of contents
Page 1
PMEG2015EH; PMEG2015EJ 20 V, 1.5 A very low V Rev. 03 — 15 January 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection encapsulated in ...
Page 2
... FRM I non-repetitive peak forward FSM current P total power dissipation tot T junction temperature j T ambient temperature amb PMEG2015EH_EJ_3 Product data sheet PMEG2015EH; PMEG2015EJ 20 V, 1.5 A very low V Pinning Description cathode anode Ordering information Package Name Description - plastic surface mounted package; 2 leads SC-90 plastic surface mounted package ...
Page 3
... Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode Characteristics Table 8. ° amb Symbol [1] Pulse test: t PMEG2015EH_EJ_3 Product data sheet PMEG2015EH; PMEG2015EJ 20 V, 1.5 A very low V Limiting values …continued Conditions Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient PMEG2015EH PMEG2015EJ thermal resistance from ...
Page 4
... T amb Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2015EH_EJ_3 Product data sheet PMEG2015EH; PMEG2015EJ 20 V, 1.5 A very low V 006aaa402 (μ ...
Page 5
... The -xxx numbers are the last three digits of the 12NC ordering code. Type number Package PMEG2015EH SOD123F PMEG2015EJ SOD323F [1] For further information and the availability of packing methods, see 10. Soldering 2.1 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD123F PMEG2015EH_EJ_3 Product data sheet PMEG2015EH; PMEG2015EJ 20 V, 1.5 A very low V 1.2 1.0 0.55 0.35 2.7 2.3 0.25 0.10 ...
Page 6
... NXP Semiconductors Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD323F (SC-90) PMEG2015EH_EJ_3 Product data sheet PMEG2015EH; PMEG2015EJ 20 V, 1.5 A very low V 3.05 2.80 2.10 1.60 1.65 0.95 0.50 (2×) Rev. 03 — 15 January 2010 MEGA Schottky barrier rectifiers F solder lands solder resist 0.50 0.60 occupied area ...
Page 7
... PMEG2015EH_EJ_3 Product data sheet PMEG2015EH; PMEG2015EJ 20 V, 1.5 A very low V MEGA Schottky barrier rectifiers F Data sheet status Change notice Product data sheet - Product data sheet - Product data sheet - Rev. 03 — 15 January 2010 Supersedes PMEG2015EH_EJ_2 PMEG2015EJ_1 - © NXP B.V. 2010. All rights reserved ...
Page 8
... NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 13. Contact information For more information, please visit: For sales office addresses, please send an email to: PMEG2015EH_EJ_3 Product data sheet PMEG2015EH; PMEG2015EJ 20 V, 1.5 A very low V [3] Definition This document contains data from the objective specification for product development ...
Page 9
... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 15 January 2010 Document identifier: PMEG2015EH_EJ_3 ...