BAS16_SER NXP Semiconductors, BAS16_SER Datasheet
BAS16_SER
Related parts for BAS16_SER
BAS16_SER Summary of contents
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BAS16 series High-speed switching diodes Rev. 05 — 25 August 2008 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W ...
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... BAS16H; BAS16J; BAS316; BAS516 1 2 BAS16L 1 2 BAS16VV; BAS16VY [1] The marking bar indicates the cathode. BAS16_SER_5 Product data sheet Quick reference data Parameter Conditions reverse voltage reverse current reverse recovery time = mA Pinning ...
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... BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W BAS316 BAS516 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BAS16_SER_5 Product data sheet Ordering information Package Name Description - plastic surface-mounted package; 3 leads - plastic surface-mounted package; 2 leads SC-90 plastic surface-mounted package; 2 leads - leadless ultra small plastic package; 2 terminals; ...
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... In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM P tot BAS16_SER_5 Product data sheet Limiting values Parameter Conditions repetitive peak reverse voltage reverse voltage forward current BAS16 BAS16H BAS16L BAS16T BAS16VV BAS16VY BAS16W ...
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... Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [8] Soldering points at pins 4, 5 and 6. 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-t) BAS16_SER_5 Product data sheet Limiting values …continued Parameter Conditions junction temperature ambient temperature storage temperature Thermal characteristics ...
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... Per diode [1] Pulse test: t [2] When switched from I [3] When switched from I BAS16_SER_5 Product data sheet Thermal characteristics …continued Parameter Conditions thermal resistance from junction to solder point BAS16H BAS16J BAS16T BAS16VY BAS316 BAS516 Characteristics Parameter Conditions ...
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... T = 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAS16_SER_5 Product data sheet 006aab132 I FSM 1.0 1.2 1.4 V (V) F Fig 2. 006aab133 60 80 100 V (V) R Fig 4. Rev. 05 — 25 August 2008 ...
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... Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms 9. Package outline 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 7. Package outline BAS16 (SOT23/TO-236AB) BAS16_SER_5 Product data sheet SAMPLING OSCILLOSCOPE mga881 = 0.6 ns; reverse voltage pulse duration ...
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... Package outline BAS16J (SOD323F/SC-90) 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Fig 11. Package outline BAS16T (SOT416/SC-75) 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 13. Package outline BAS16VY (SOT363) BAS16_SER_5 Product data sheet 0.80 0.65 0.5 0.3 0.25 0.10 04-09-13 Dimensions in mm Fig 10. Package outline BAS16L (SOD882) 0.95 0.60 0.45 0.15 1.7 1.5 2 0.30 0.25 0.15 0.10 04-11-04 Dimensions in mm Fig 12. Package outline BAS16VV (SOT666) 1.1 0.8 0. ...
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... BAS16VY SOT363 BAS16W SOT323 BAS316 SOD323 BAS516 SOD523 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping BAS16_SER_5 Product data sheet 1.1 0.8 0.45 0.15 1.65 1.55 0.25 0.10 03-12-17 Dimensions in mm Fig 16. Package outline BAS516 (SOD523/SC-79) Description 4 mm pitch tape and reel ...
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... NXP Semiconductors 11. Soldering 3 1.7 Fig 17. Reflow soldering footprint BAS16 (SOT23/TO-236AB) 4.6 2.6 Fig 18. Wave soldering footprint BAS16 (SOT23/TO-236AB) BAS16_SER_5 Product data sheet 3.3 2.9 1 2 1.4 2.8 4.5 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes solder lands solder resist 2 solder paste occupied area ...
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... NXP Semiconductors Fig 19. Reflow soldering footprint BAS16H (SOD123F) 1.65 Fig 20. Reflow soldering footprint BAS16J (SOD323F) BAS16_SER_5 Product data sheet 4.4 4 2.9 1.6 2.1 1.6 1 Reflow soldering is the only recommended soldering method. Dimensions in mm 3.05 2.2 2.1 0. Reflow soldering is the only recommended soldering method. Rev. 05 — 25 August 2008 ...
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... NXP Semiconductors 0.9 Fig 21. Reflow soldering footprint BAS16L (SOD882) Fig 22. Reflow soldering footprint BAS16T (SOT416/SC-75) BAS16_SER_5 Product data sheet 1.3 0 Reflow soldering is the only recommended soldering method. 2.2 1.7 0.85 0 1.3 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes R0. 0.6 0 Dimensions in mm solder lands ...
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... NXP Semiconductors 2 1.7 Fig 23. Reflow soldering footprint BAS16VV (SOT666) Fig 24. Reflow soldering footprint BAS16VY (SOT363/SC-88) BAS16_SER_5 Product data sheet 2.75 2.45 2.1 1.6 0.538 0.55 1.075 (2 ) 1 Reflow soldering is the only recommended soldering method. 2.65 2.35 1.5 0 1.8 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes ...
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... NXP Semiconductors 4.5 Fig 25. Wave soldering footprint BAS16VY (SOT363/SC-88) Fig 26. Reflow soldering footprint BAS16W (SOT323/SC-70) BAS16_SER_5 Product data sheet 1.3 1.3 2.45 5.3 2.65 1.85 1.325 2 0 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes 1.5 0.3 2.5 1.5 Dimensions in mm preferred transport direction during soldering solder lands solder resist solder paste 1 ...
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... NXP Semiconductors 3.65 2.1 Fig 27. Wave soldering footprint BAS16W (SOT323/SC-70) 1.65 Fig 28. Reflow soldering footprint BAS316 (SOD323/SC-76) BAS16_SER_5 Product data sheet 4.6 2.575 1.425 (3 ) 3.05 2.1 0.95 2 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes 1.8 Dimensions in mm preferred transport 09 direction during soldering (2 ) solder lands solder resist ...
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... NXP Semiconductors 2.75 Fig 29. Wave soldering footprint BAS316 (SOD323/SC-76) Fig 30. Reflow soldering footprint BAS516 (SOD523/SC-79) BAS16_SER_5 Product data sheet 5 2 2.15 1.1 1 Reflow soldering is the only recommended soldering method. Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes solder lands solder resist ...
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... BAS16VV_BAS16VY_3 20070420 BAS16W_4 19990506 BAS316_4 20040204 BAS516_1 19980831 BAS16_SER_5 Product data sheet Data sheet status Product data sheet codes”: marking code amended for BAS16W values”: for BAS16, BAS16T, BAS16W and BAS516 change of maximum value from 100 V RRM values”: for BAS16, BAS16L, BAS16T, BAS16W and BAS516 change of ...
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... NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 14. Contact information For more information, please visit: For sales office addresses, please send an email to: BAS16_SER_5 Product data sheet [3] Definition This document contains data from the objective specification for product development. ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 25 August 2008 Document identifier: BAS16_SER_5 ...