BAV756S_BAW56_SER NXP Semiconductors, BAV756S_BAW56_SER Datasheet - Page 10

• Manufacturer Part Number: BAV756S_BAW56_SER
• Description: High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)plastic packages
• Manufacturer: NXP Semiconductors

NXP Semiconductors
BAV756S_BAW56_SER_5
Product data sheet
Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB)
Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101)
4.60
Reflow soldering is the only recommended soldering method.
4.00
1.20
0.90
R = 0.05 (12 )
0.20
Rev. 05 — 26 November 2007
0.35
0.25
(2 )
(2 )
solder lands
solder paste
2
3.40
2.80
4.50
0.30
0.40
0.50
(2 )
(2 )
(2 )
3
1.20 (2x)
BAV756S; BAW56 series
1
1.30
0.30
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
0.30
0.40
0.50
Dimensions in mm
High-speed switching diodes
solder lands
solder resist
occupied area
R = 0.05 (12 )
0.60 0.70 0.80
© NXP B.V. 2007. All rights reserved.
sot023
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