LPC1769FBD100 NXP Semiconductors, LPC1769FBD100 Datasheet - Page 76

The LPC1769 is a Cortex-M3 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 120 MHz

LPC1769FBD100

Manufacturer Part Number
LPC1769FBD100
Description
The LPC1769 is a Cortex-M3 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 120 MHz
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
LPC1769_68_67_66_65_64_63
Product data sheet
Fig 40. Reflow soldering of the TFBGA100 package
Footprint information for reflow soldering of TFBGA100 package
DIMENSIONS in mm
0.80
P
0.330
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.480
SR
P
9.400
Hx
9.400
Refer to the package outline drawing for actual layout
Hy
All information provided in this document is subject to legal disclaimers.
P
Rev. 8 — 14 November 2011
Generic footprint pattern
LPC1769/68/67/66/65/64/63
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
© NXP B.V. 2011. All rights reserved.
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