LPC1774FBD208 NXP Semiconductors, LPC1774FBD208 Datasheet - Page 113

• Manufacturer Part Number: LPC1774FBD208
• Description: The LPC1774 is a Cortex-M3 microcontroller for embedded applications featuring a high level of integration and low power consumption at frequencies of 120 MHz
• Manufacturer: NXP Semiconductors

NXP Semiconductors
LPC178X_7X
Objective data sheet
Fig 47. Reflow soldering of the TFBGA180 package
Footprint information for reflow soldering of TFBGA180 package
DIMENSIONS in mm
0.80
P
0.400
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.550
SR
P
12.575 12.575
Hx
Refer to the package outline drawing for actual layout
Hy
P
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 27 December 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
LPC178x/7x
© NXP B.V. 2011. All rights reserved.
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