NX3008PBKW NXP Semiconductors, NX3008PBKW Datasheet - Page 12

• Manufacturer Part Number: NX3008PBKW
• Description: P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Soldering
NX3008PBKW
Product data sheet
Fig 19. Reflow soldering footprint for SOT323 (SC-70)
Fig 20. Wave soldering footprint for SOT323 (SC-70)
3.65 2.1
2.35
(3×)
0.6
1.425
(3×)
0.55
(3×)
3
2.65
1.85
All information provided in this document is subject to legal disclaimers.
2.575
4.6
1.325
2
1
Rev. 1 — 1 August 2011
(3×)
0.5
1.3
(2×)
09
1.8
30 V, 200 mA P-channel Trench MOSFET
Dimensions in mm
direction during soldering
Dimensions in mm
NX3008PBKW
preferred transport
solder lands
solder resist
solder paste
occupied area
sot323_fr
solder lands
solder resist
occupied area
sot323_fw
© NXP B.V. 2011. All rights reserved.
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