PSMN165-200K NXP Semiconductors, PSMN165-200K Datasheet

SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology

PSMN165-200K

Manufacturer Part Number
PSMN165-200K
Description
SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology
Manufacturer
NXP Semiconductors
Datasheet

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PSMN165-200K
Manufacturer:
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Part Number:
PSMN165-200K
Manufacturer:
NXP
Quantity:
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1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET) in
a plastic package using TrenchMOS technology. This product is designed and qualified for
use in computing, communications, consumer and industrial applications only.
Table 1.
Symbol Parameter
V
I
P
Dynamic characteristics
Q
Static characteristics
R
D
DS
tot
GD
DSon
Low conduction losses due to low
on-state resistance
Computer motherboards
DC-to-DC convertors
PSMN165-200K
N-channel TrenchMOS SiliconMAX standard level FET
Rev. 02 — 3 December 2009
drain-source voltage T
drain current
total power
dissipation
gate-drain charge
drain-source
on-state resistance
Quick reference
Conditions
T
see
T
see
V
V
see
V
T
see
j
sp
sp
j
GS
DS
GS
≥ 25 °C; T
= 25 °C;
= 80 °C;
= 80 °C;
Figure 1
Figure 2
Figure 11
Figure 9
= 100 V; T
= 10 V; I
= 10 V; I
j
D
D
and
and
≤ 150 °C
= 3 A;
= 2.5 A;
j
= 25 °C;
3
10
Suitable for high frequency
applications due to fast switching
characteristics
Switched-mode power supplies
Min
-
-
-
-
-
Product data sheet
Typ
-
-
-
12
130
Max
200
2.9
3.5
16.5
165
Unit
V
A
W
nC
mΩ

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PSMN165-200K Summary of contents

Page 1

... PSMN165-200K N-channel TrenchMOS SiliconMAX standard level FET Rev. 02 — 3 December 2009 1. Product profile 1.1 General description SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET plastic package using TrenchMOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only. ...

Page 2

... Figure 1 and 3 sp ≤ 10 µs; pulsed ° °C; see Figure °C sp ≤ 10 µs; pulsed ° Rev. 02 — 3 December 2009 PSMN165-200K Graphic symbol mbb076 4 Version SOT96-1 Min Max Unit - 200 ...

Page 3

... T (°C) sp Fig 2. Normalized total power dissipation as a function of solder point temperature / D.C. δ Rev. 02 — 3 December 2009 PSMN165-200K 03aa17 50 100 150 T (°C) sp 03ae06 µs p 100 µ 100 (V) DS © NXP B.V. 2009. All rights reserved. ...

Page 4

... Transient thermal impedance from junction to solder point as a function of pulse duration PSMN165-200K_2 Product data sheet N-channel TrenchMOS SiliconMAX standard level FET Conditions mounted on a metal clad substrate; see Figure 4 −3 −2 − Rev. 02 — 3 December 2009 PSMN165-200K Min Typ Max - - 20 03ae05 t p δ ...

Page 5

... 2 ° see Figure 2 ° see Figure 2 /dt = -100 A/µ ° Rev. 02 — 3 December 2009 PSMN165-200K Min Typ Max Unit 200 240 - V 1 µ 0 ...

Page 6

... V GS(th) (V) max − (V) GS Fig 8. Gate-source threshold voltage as a function of junction temperature Rev. 02 — 3 December 2009 PSMN165-200K 03ae09 V > DSon = 150 °C 25 ° (V) GS 03aa32 max typ ...

Page 7

... C oss , C rss (pF (nC) G Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values Rev. 02 — 3 December 2009 PSMN165-200K 03aa31 0 60 120 ( ° 03ae12 C iss C oss C rss − (V) DS © NXP B.V. 2009. All rights reserved. ...

Page 8

... N-channel TrenchMOS SiliconMAX standard level FET 03ae10 ( (A) D Fig 14. Source current as a function of source-drain voltage; typical values Rev. 02 — 3 December 2009 PSMN165-200K 03ae11 = 150 °C 25 ° 0.2 0.4 0.6 0 (V) SD © NXP B.V. 2009. All rights reserved ...

Page 9

... 0.49 0.25 5.0 4.0 6.2 1.27 0.36 0.19 4.8 3.8 5.8 0.019 0.0100 0.20 0.16 0.244 0.05 0.041 0.014 0.0075 0.19 0.15 0.228 REFERENCES JEDEC JEITA MS-012 Rev. 02 — 3 December 2009 PSMN165-200K θ detail 1.0 0.7 1.05 0.25 0.25 0.1 0.4 0.6 0.039 0.028 0.028 0.01 0.01 0.004 0.016 ...

Page 10

... Legal texts have been adapted to the new company name where appropriate. PSMN165-200K-01 20010116 PSMN165-200K_2 Product data sheet N-channel TrenchMOS SiliconMAX standard level FET Data sheet status Change notice Product data sheet - Product specification - Rev. 02 — 3 December 2009 PSMN165-200K Supersedes PSMN165-200K-01 - © NXP B.V. 2009. All rights reserved ...

Page 11

... Export might require a prior authorization from national authorities. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS— trademark of NXP B.V. to:salesaddresses@nxp.com Rev. 02 — 3 December 2009 PSMN165-200K © NXP B.V. 2009. All rights reserved ...

Page 12

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 3 December 2009 Document identifier: PSMN165-200K_2 ...

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