1410210-1 TE Connectivity, 1410210-1 Datasheet - Page 4

1410210-1

Manufacturer Part Number
1410210-1
Description
Manufacturer
TE Connectivity
Series
Noner
Datasheets

Specifications of 1410210-1

Product Type
Connector
Type Of Connector
Backplane
Mount Angle
Vertical
Module Type
Center
Data Rate (gb/s)
3.125
Solder Tail Contact Plating
Tin-Lead over Nickel
Card Slot Pitch (mm [in])
25.4 [1]
Number Of Columns
16
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold
Housing Material
Liquid Crystal Polymer (LCP)
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Density
141 lines/inch
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Minute disturbance.
Therm al shock.
Hum idity/tem perature cycling.
Tem perature life.
Mixed flowing gas.
Dust contam ination.
Rev D
NOTE
Test Description
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure
2.
See Note.
See Note.
See Note.
See Note.
See Note.
See Note.
ENVIRONMENTAL
Figure 1 (end)
Requirem ent
Unm ate and m ate specim ens a
distance of approxim ately 0.1 m m
[.004 in].
EIA-364-32, Test Condition VII.
Subject m ated specim ens to 5
cycles between -55 and 105 C.
EIA-364-31, Method III.
Subject m ated specim ens to 10
cycles (10 days) between 25 and
65 C at 80 to 100% RH.
EIA-364-17, Method A, Test
Condition 4, Test Tim e Condition C.
Subject m ated specim ens to 105 C
for 500 hours.
EIA-364-65, Class IIA (4 gas).
Subject m ated and unm ated
specim ens to environm ental Class
IIA for 20 days.
EIA-364-91.
Subject unm ated specim ens to dust
contam ination for 1 hour.
Procedure
108-2072
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