1410210-1 TE Connectivity, 1410210-1 Datasheet - Page 8

• Manufacturer Part Number: 1410210-1
• Manufacturer: TE Connectivity
• Series: Noner

Specifications of 1410210-1

• Product Type: Connector
• Type Of Connector: Backplane
• Mount Angle: Vertical
• Module Type: Center
• Data Rate (gb/s): 3.125
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Card Slot Pitch (mm [in]): 25.4 [1]
• Number Of Columns: 16
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold
• Housing Material: Liquid Crystal Polymer (LCP)
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Density: 141 lines/inch
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant

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4.
4.1.
4.2.
4.3.
Rev D
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form , fit or function are m ade to the product or m anufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determ ined by developm ent/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product m eets the requirem ents of Figure 1. Failures
attributed to equipm ent, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specim ens resubm itted for qualification. Testing to
confirm corrective action is required before resubm ittal.
Specim en Selection
1.
2.
3.
Test Sequence
Qualification inspection shall be verified by testing specim ens as specified in Figures 2A, 2B and
2C.
Tier 1 Product
Specim ens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Each test group shall consist of 8 m ale and 8
fem ale connector assem blies. Low level contact resistance circuit data, where tested, shall be
collected and evaluated from a m inim um of 100 circuits chosen at random from those
assem blies. Low level contact resistance com pliant pin data, where tested, shall be collected
and evaluated from a m inim um of 50 pins chosen at random from those assem blies.
Tier 2 Product
Specim ens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Test groups 1 and 2 shall each consist of 12
m ale and 12 fem ale connector assem blies. Test groups 3 and 4 shall each consist of 8 m ale
and 8 fem ale connector assem blies. Test group 5 shall consist of 7 m ale and 7 fem ale
connector assem blies. Low level contact resistance circuit data, where tested, shall be
collected and evaluated from a m inim um of 96 circuits chosen at random from those
assem blies. Low level contact resistance com pliant pin data, where tested, shall be collected
and evaluated from a m inim um of 100 pins chosen at random from those assem blies.
RT2 Mezzanine Product
Specim ens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Each test group shall consist of 4, 42 m m stack
height Mezzanine connectors and 8, 20.3 m m MULTIGIG RT2 vertical receptacle assem bly
backplane connectors. Low level contact resistance circuit data, where tested, shall be
collected and evaluated from a m inim um of 100 circuits chosen at random from those
assem blies.
108-2072
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