STPS1L30 STMicroelectronics, STPS1L30 Datasheet

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STPS1L30

Manufacturer Part Number
STPS1L30
Description
Low Drop Power Schottky Rectifier
Manufacturer
STMicroelectronics
Datasheet

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Table 1: Main Product Characteristics
FEATURES AND BENEFITS
DESCRIPTION
Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequency DC to DC con-
verters, freewheel diode and integrated circuit
latch up protection.
Packaged in SMA and SMB, this device is espe-
cially intended for use in parallel with MOSFETs in
synchronous rectification.
Table 3: Absolute Ratings (limiting values)
August 2004
* :
Symbol
I
V
F(RMS)
I
P
dV/dt
I
I
I
dPtot
---------------
Very low forward voltage drop for less power
dissipation
Optimized conduction/reverse losses trade-off
which means the highest yield in the
applications
Surface mount miniature packages
Avalanche capability specified
F(AV)
T
RRM
FSM
RSM
RRM
ARM
dTj
T
stg
j
>
V
T
------------------------- -
Rth j a
V
j
F
I
F(AV)
(max)
(max)
Repetitive peak reverse voltage
RMS forward voltage
Average forward current
Surge non repetitive forward current
Repetitive peak reverse current
Non repetitive peak reverse current
Repetitive peak avalanche power
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
RRM
®
(
1
)
thermal runaway condition for a diode on its own heatsink
LOW DROP POWER SCHOTTKY RECTIFIER
150°C
0.3 V
30 V
1 A
Parameter
REV. 6
T
tp = 10ms sinusoidal
tp = 2µs F = 1kHz square
tp = 100µs square
tp = 1µs Tj = 25°C
L
Table 2: Order Codes
= 135°C δ = 0.5
(JEDEC DO-214AC)
Part Number
STPS1L30A
STPS1L30U
STPS1L30A
SMA
STPS1L30
-65 to + 150
(JEDEC DO-214AA)
10000
Value
1500
STPS1L30U
150
30
10
75
Marking
1
1
1
GB3
G23
SMB
Unit
V/µs
°C
°C
W
V
A
A
A
A
A
1/7

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STPS1L30 Summary of contents

Page 1

... Part Number STPS1L30A STPS1L30U Parameter = 135°C δ 10ms sinusoidal tp = 2µ 1kHz square tp = 100µs square tp = 1µ 25°C REV. 6 STPS1L30 SMA SMB (JEDEC DO-214AA) STPS1L30U Marking GB3 G23 Value 1500 - 150 150 10000 Unit ...

Page 2

... STPS1L30 Table 4: Thermal Resistance Symbol R Junction to lead th(j-l) Table 5: Static Electrical Characteristics Symbol Parameter I * Reverse leakage current Forward voltage drop F δ Pulse test 380 µs, < evaluate the conduction losses use the following equation 0.225 x I Figure 1: Average forward power dissipation ...

Page 3

... C(pF) 500 100 t(s) δ =0.5 1E-2 1E-1 8: Relative variation (epoxy printed circuit /R th(j-c) th(j-c) δ = 0.2 δ = 0.1 t (s) p 1E-1 1E+0 1E+1 10: Junction capacitance V ( STPS1L30 T =25° =50° =100°C a 1E+0 of thermal board, T δ tp =tp/T 1E+2 5E+2 versus F=1MHz T =25° 3/7 ...

Page 4

... STPS1L30 Figure 11: Forward voltage drop versus forward current (typical values, high level) I (A) FM 10.00 T =100° =150°C j 1.00 V (V) FM 0.10 0.0 0.1 0.2 0.3 0.4 Figure 13: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMA) R (° ...

Page 5

... Figure 15: SMA Package Mechanical Data Figure 16: SMA Foot Print Dimensions (in millimeters) 1.45 2.40 1.45 REF 1.65 STPS1L30 DIMENSIONS Millimeters Inches Min. Max. Min. 1.90 2.03 0.075 0.05 0.20 0.002 1.25 1.65 0.049 0.15 0.41 0.006 4.80 5.60 0.189 3.95 4.60 0.156 2.25 2.95 0.089 0.75 1.60 0.030 Max. 0.080 0.008 0.065 0.016 0.220 0.181 ...

Page 6

... STPS1L30 Figure 17: SMB Package Mechanical Data Figure 18: SMB Foot Print Dimensions (in millimeters) 1.52 2.75 6/7 REF 2.3 1.52 DIMENSIONS Millimeters Inches Min. Max. Min. 1.90 2.45 0.075 0.05 0.20 0.002 1.95 2.20 0.077 0.15 0.41 0.006 5.10 5.60 0.201 4.05 4.60 0.159 3.30 3.95 0.130 0.75 1.60 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 ...

Page 7

... All other names are the property of their respective owners © 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Weight Base qty Delivery mode 0.068 g 5000 Tape & reel 0.107 g 2500 Tape & reel Description of Changes STPS1L30 7/7 ...

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