STPS30L45C STMicroelectronics, STPS30L45C Datasheet
STPS30L45C
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STPS30L45C Summary of contents
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... Low drop power Schottky rectifier PAK STPS30L45CR A1 TO-220AB STPS30L45CT TO-220FPAB STPS30L45CFP Table 1. Device summary I F(AV) V RRM T (max (max) F Doc ID 8002 Rev 4 STPS30L45C PAK STPS30L45CG TO-247 STPS30L45CW 150 °C 0.5 V 1/12 www.st.com 12 ...
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... PAK, D PAK (Per diode) + P(diode th(j-c) Doc ID 8002 Rev 4 Value 45 30 Per diode 15 Per device 30 220 °C 6000 j - 150 150 10000 Value Per diode 4 Total 3.2 Per diode 1.60 Total 0.85 2.5 0.10 th(c) STPS30L45C Unit °C °C V/µs Unit °C/W °C/W ...
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... STPS30L45C Table 4. Static electrical characteristics (per diode) Symbol Parameter (1) I Reverse leakage current R (1) V Forward voltage drop F 1. Pulse test 380 µs, δ < evaluate the conduction losses use the following equation 0.330 x I Figure 1. Average forward power dissipation versus average forward current ...
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... Figure 10. Junction capacitance versus C(pF) 2000 1000 500 200 VR(V) 100 Doc ID 8002 Rev 4 STPS30L45C Non repetitive surge peak forward current versus overload duration (TO-220FPAB only) maximum values, per diode t(s) t δ =0.5 1E-2 1E-1 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) tp(s) δ ...
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... STPS30L45C Figure 11. Forward voltage drop versus forward current (maximum values, per diode) IFM(A) 200 100 Typical values Tj=150°C 10 Tj=125°C Tj=25°C VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D Rth(j-a) (°C/ ...
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... 6/12 Ref Dia. Doc ID 8002 Rev 4 STPS30L45C Dimensions Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 ...
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... STPS30L45C Mounting (soldering) the I IS NOT PERMITTED. A standard through-hole mounting is mandatory. 2 Table 6. I PAK dimensions PAK metal slug (heatsink) with alloy, like a surface mount device, Ref Doc ID 8002 Rev 4 ...
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... 8/12 Ref Dia Dia. Doc ID 8002 Rev 4 STPS30L45C Dimensions Millimeters Inches Min. Max. Min. Max. 4.4 4.6 0.173 0.181 2.5 2.7 0.098 0.106 2.5 2.75 0.098 0.108 0.45 0.70 0.018 0.027 0.75 1 0.030 0.039 1.15 1.70 0.045 0.067 1.15 1.70 0.045 ...
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... STPS30L45C 2 Table 8. D PAK package dimensions Figure 13. D PAK footprint dimensions (in millimeters) Ref FLAT ZONE NO LESS THAN 2mm V2 16.90 10.30 8.90 Doc ID 8002 Rev 4 Package Information Dimensions Millimeters Inches Min. Max. Min. A 4.40 4.60 0.173 2 ...
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... Dimension D plus gate protrusion does not exceed 20 Resin thickness around the mounting hole is not less than 0.9 mm 10/12 Heat-sink plane A ∅P ∅ BACK VIEW A1 Doc ID 8002 Rev 4 STPS30L45C Dimensions Ref. Millimeters Min. Max. Min. A 4.85 5.15 0.191 A1 2.20 2.60 0.086 b 1.00 1.40 0.039 b1 2 ...
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... STPS30L45CW STPS30L45CR STPS30L45CFP 4 Revision history Table 11. Document revision history Date Jul-2003 13-Oct-2010 Marking Package STPS30L45CT TO-220AB 2 STPS30L45CG D PAK 2 STPS30L45CG D PAK STPS30L45CW TO-247 2 STPS30L45CR I PAK STPS30L45CFP TO-220FPAB Revision 3B Previous issue Added paragraph above 4 Table 6. Updated TO-247 dimensions in Doc ID 8002 Rev 4 Ordering Information ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 12/12 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 8002 Rev 4 STPS30L45C ...