STPS5L25 STMicroelectronics, STPS5L25 Datasheet

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STPS5L25

Manufacturer Part Number
STPS5L25
Description
Low Drop Power Schottky Rectifier
Manufacturer
STMicroelectronics
Datasheet

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Features
Description
Single Schottky rectifier suited to switched mode
power supplies and high frequency DC to DC
converters.
This device is especially intended for use as a
rectifier at the secondary of 3.3 V SMPS units.
April 2008
Very low forward voltage drop for less power
dissipation and reduced heatsink
Optimized conduction/reverse losses trade-off
which means the highest efficiency in the
applications
High power surface mount miniature package
Avalanche capability specified
Rev 6
Low drop power Schottky rectifier
Table 1.
V
T
V
I
j
F
F(AV)
(max)
(max)
RRM
Device summary
3
4
DPAK
1
NC
2
STPS5L25
2
4 (TAB)
3
150 °C
0.35 V
25 V
5 A
www.st.com
1/7
7

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STPS5L25 Summary of contents

Page 1

... This device is especially intended for use as a rectifier at the secondary of 3.3 V SMPS units. April 2008 Low drop power Schottky rectifier 3 4 DPAK Table 1. Device summary I F(AV) V RRM T (max (max) F Rev 6 STPS5L25 2 4 (TAB 150 °C 0.35 V 1/7 www.st.com 7 ...

Page 2

... T = 125 ° ° 125 ° ° 125 ° STPS5L25 Value Unit 3000 W - 150 °C 150 °C 10000 V/µs Value Unit 2.5 °C/W Min. ...

Page 3

... STPS5L25 Figure 1. Average forward power dissipation versus average forward current PF(av)(W) 2.5 δ = 0.2 δ = 0.1 2.0 δ = 0.05 1.5 1.0 0.5 IF(av) (A) 0 Figure 3. Normalized avalanche power derating versus pulse duration ARM p P (1µs) ARM 1 0.1 0.01 t (µs) p 0.001 0.01 0.1 1 Figure 5. Non repetitive surge peak forward current versus overload duration ...

Page 4

... Figure 10. Thermal resistance junction to Rth(j-a) (°C/W) 100 Junction capacitance versus reverse voltage applied (typical values) VR( ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 µ S(Cu) (cm²) STPS5L25 F=1MHz Tj=25° ...

Page 5

... STPS5L25 2 Package Information ● Epoxy meets UL94 order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...

Page 6

... Ordering information Table 5. Ordering information Order code STPS5L25B-TR 4 Revision history Table 6. Document revision history Date Jul-2003 15-Apr-2008 6/7 Marking Package STPS5L25B DPAK Revision 5A Previous release. 6 Reformatted to current standards. Corrected order code in Weight Base qty Delivery mode 0.30 g 2500 Tape and reel Changes STPS5L25 Table 5. ...

Page 7

... STPS5L25 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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