STPS1L40 STMicroelectronics, STPS1L40 Datasheet
STPS1L40
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STPS1L40 Summary of contents
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... June 2009 Low drop power Schottky rectifier A K SMA (JEDEC DO-214AC) STPS1L40A STPS1L40MF Table 1. Device summary Symbol I F(AV) V RRM T (max (max) F Doc ID 5507 Rev 6 STPS1L40 A K SMB (JEDEC DO-214AA) STPS1L40U A K STmite flat Value 150 °C 0.42 V 1/11 www.st.com 11 ...
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... ° 125 ° ° 125 ° (RMS) Doc ID 5507 Rev 6 STPS1L40 Value °C 900 150 150 10000 Value Unit SMA 30 SMB 25 °C/W STmite flat 20 Min. ...
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... STPS1L40 Figure 1. Average forward power dissipation versus average forward current P F(AV) (W) 0.8 0.7 δ = 0.1 δ = 0.2 δ = 0.05 0.6 0.5 0.4 0.3 0.2 0.1 I F(AV) (A) 0.0 0.0 0.2 0.4 0.6 0.8 Figure 3. Average forward current versus ambient temperature (SMB, δ = 0.5) I F(AV) ( th(j- th(j- th(j-a) = 100 °C δ Figure 5. ...
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... Epoxy printed circuit board, 0.8 copper thickness = 35 µm, recommended pad layout 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse 0 (s) 0.0 1.E+02 1.E+03 1.E-02 Doc ID 5507 Rev 6 STPS1L40 Non repetitive surge peak forward current versus overload duration (maximum values, SMB) SMB ° ° 125 °C t 1.E-03 1.E-02 1.E-01 impedance junction to ambient versus pulse duration (SMA) 1.E-01 1.E+00 1.E+01 1.E+02 ...
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... STPS1L40 Figure 13. Reverse leakage current versus reverse voltage applied (typical values (mA) 1.E+ 150 °C 1.E+ 125 ° 100 °C 1.E+ °C 1.E- °C 1.E- °C 1.E- Figure 15. Forward voltage drop versus forward current (typical values, high level (A) 10. 125 ° ...
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... S cu (cm²) 0 3.0 3.5 4.0 4.5 5.0 0.0 R th(j-a) (°C/W) Epoxy printed circuit board, FR4 copper thickness = 35 µ 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Doc ID 5507 Rev 6 ambient versus copper surface under each lead (SMB) Epoxy printed circuit board, FR4 copper thickness = 35 µm 0.5 1.0 1.5 2.0 2.5 3.0 3.5 STmite flat S cu (cm²) 3.5 4.0 4.5 5.0 STPS1L40 SMB S cu (cm²) 4.0 4.5 5.0 ...
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... STPS1L40 2 Package information ● Epoxy meets UL94, V0 ● Cathode band (SMA, SMB) In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ...
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... Table 6. SMB dimensions Figure 21. Footprint, dimensions in mm (inches) 8/11 Ref 1.62 2.60 1.62 (0.064) (0.102) (0.064) 5.84 (0.300) Doc ID 5507 Rev 6 STPS1L40 Dimensions Millimeters Inches Min. Max. Min. Max. 1.90 2.45 0.075 0.096 0.05 0.20 0.002 0.008 1.95 2.20 0.077 0.087 0.15 0.40 0.006 0.016 3.30 3.95 0.130 0.156 5.10 5 ...
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... STPS1L40 Table 7. STmite flat dimensions E1 E Figure 22. Footprint dimensions (0.026 0.85 0.63 2.00 (0.033) (.025) (0.079) 0.65 4.13 (0.163) millimeters (inches) Doc ID 5507 Rev 6 Package information Dimensions Ref. Millimeters Min. Typ. Max. Min. A 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0 ...
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... STmite flat Revision 4A Last update. SMA package dimensions update. Reference A1 max. 5 changed from 2.70 mm (0.106 inch.) to 2.03 mm (0.080). 6 Added STmite flat package. Doc ID 5507 Rev 6 STPS1L40 Weight Base qty Delivery mode 0.068 g 5000 Tape and reel 0.107 g 2500 Tape and reel 0.016 g ...
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... STPS1L40 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...