ST7LNB0V2Y0 STMicroelectronics, ST7LNB0V2Y0 Datasheet - Page 26

• Manufacturer Part Number: ST7LNB0V2Y0
• Description: DiSEqC™ 2.1 Slave Microcontroller for LNBs and Switchers
• Manufacturer: STMicroelectronics

Package characteristics
7.2
7.3
26/30
Thermal characteristics
Table 25.
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
Soldering information
In order to meet environmental requirements, ST offers the ST7LNB0V2Y0 in ECOPACK
package. The package have a Lead-free second level interconnect. The category of second
Level Interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com,
together with specific technical application notes covering the main technical aspects
related to lead-free conversion (AN2033, AN2034, AN2035, AN2036).
Backward and forward compatibility
The main difference between Pb and Pb-free soldering process is the temperature range.
Table 26.
1. Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label) is
SDIP & PDIP
QFN
LQFP and SO
)
Symbol
The power dissipation of an application can be defined by the user with the formula: P
where P
ports used in the application.
compatible with their Lead-free soldering process.
P
T
R
Package
ECOPACK LQFP, SDIP, SO and QFN20 packages are fully compatible with Lead (Pb)
containing soldering process (see application note AN2034)
TQFP, SDIP and SO Pb-packages are compatible with Lead-free soldering process,
nevertheless it's the customer's duty to verify that the Pb-packages maximum
temperature (mentioned on the Inner box label) is compatible with their Lead-free
soldering temperature.
Dmax
Jmax
thJA
INT
is the chip internal power (I
Thermal characteristics
Soldering compatibility (wave and reflow soldering process)
Package thermal resistance (junction to ambient)
Maximum junction temperature
Power dissipation
Sn (pure Tin)
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
Plating material devices
(2)
DD
Ratings
xV
DD
) and P
(1)
PORT
is the port power dissipation depending on the
Yes
Yes
Yes
Pb solder paste
D
= (T
J
-T
A
) / R
thJA
.
Yes
Yes
Yes
Pb-free solder paste
Value
150
300
D
85
(1)
(1)
(1)
=P
INT
ST7LNB0V2Y0
+P
PORT
°C/W
Unit
mW
°C
®