X006 STMicroelectronics, X006 Datasheet
X006
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X006 Summary of contents
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... I = 200 µA GT Description Thanks to highly sensitive triggering levels, the X006 SCR series is suitable for all applications where the available gate current is limited, such as ground fault circuit interrupters, overvoltage crowbar protection in low power supplies, capacitive ignition circuits, etc. Available in though-hole or surface-mount ...
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... Test Conditions = 125 ° 125 ° ° 125 ° 125 ° ° 125 °C j X006 Value Unit ° 100 °C tab ° 100 °C tab ° ° ...
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... X006 Table 3. Thermal resistances Symbol R Junction to ambient (DC) th(j-a) R Junction to lead (DC) th(j-l) R Junction to tab (DC) th(j-t) Figure 1. Maximum average power dissipation versus average on-state current P(W) 0.6 = 180° 0.5 0.4 0.3 0.2 0.1 I (A) T(AV) 0.0 0.0 0.1 0.2 0.3 Figure 3. Average and D.C. on-state current versus ambient temperature (epoxy printed circuit board FR4, copper thickness = 35 µm, S ...
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... FR4, copper thickness = 35 µ (TO-92) /R th(j-a) TO- 0 (s) p 1.E-02 1.E-01 1.E+00 1.E+01 Thermal resistance junction to ambient versus copper surface under tab (PCB FR4, copper thickness = 35 µm) (SOT-223) (°C/W) S(cm²) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 current versus gate-cathode resistance (typical values = 1.E-01 1.E+00 1.E+01 X006 = 0.5 CU 1.E+02 1.E+03 4.0 4.5 5.0 1.E+02 ...
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... X006 Figure 11. Relative variation of dV/dt immunity versus gate-cathode resistance (typical values) dV/dt dV/dt 100.0 10.0 1 0.1 1.0E-01 1.0E+00 Figure 13. Surge peak on-state current versus number of cycles I (A) TSM Non repetitive 6 T initial=25° Repetitive T =25° Number of cycles Figure 15. On-state characteristics (maximum values) 10 ...
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... Ordering information scheme Figure 16. Ordering information scheme Sensitive SCR series Current 006 = 0.8 A Sensitivity 02 = 200 µA Voltage M = 600 V Package A = TO-92 (A"Blank" SOT-223 (N"No Blank”) Packing mode 1AA2 = Bulk 2AL2 = Ammopack 5AL2 = Tape & reel (TO-92) 5BA4 = Tape & reel (SOT-223) 6/9 X 006 1AA2 Blank X006 ...
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... X006 3 Package information ● Epoxy meets UL94 order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Document revision history Date Jan-2002 08-Aug-2006 1-Apr-2008 8/9 3.25 5.16 2.30 Marking Package X0602 MA TO-92 X06 2M SOT-223 Revision 3 Last update. 4 SOT-223 package added. Reformatted to current standards. Device X00605 removed. 5 Updated dimensions in 1.32 7.80 1.32 0.95 Weight Base qty Delivery mode 2500 Bulk 0.2 g 2000 Ammopack 2000 Tape and reel 0.12 g 1000 Changes Table 5 ...
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... X006 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...