TDA1175P STMicroelectronics, TDA1175P Datasheet - Page 9

• Manufacturer Part Number: TDA1175P
• Description: IC DEFLECTION VERT LN 16POWERDIP
• Manufacturer: STMicroelectronics
• Type: Videor

Specifications of TDA1175P

• Applications: TV
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MOUNTING INSTRUCTION
The R
pins to a suitable copper area of the printed circuit
board (Figure 11) or to an external heatsink (Fig-
ure 12).
The diagram of Figure 13 shows the maximum dis-
sipable power P
the side "I" of two equal square copper areas hav-
ing a thicknessof 35µ (1.4 mils).
During soldering the pins temperature must not
exceed 260°C and the soldering time must not be
longer than 12 seconds.
The external heatsink or printed circuit copper
area must be connected to electrical ground.
Figure 11. Example of P.C. Board Copper Area
Figure 12. External Heatsink Mounting
Example
11.9 mm
th
(j-a) can be reduced by soldering the GND
P.C. BOARD
S-3474
COPPER AREA 35
tot
and the R
µ
THICKNESS
th
(
j-a
) as a function of
38.0 mm
17.0 mm
S-3181
Figure 13. Maximum Power Dissipation and
Junction-ambient Thermal Resistance versus
"I"
Figure 14. Maximum Allowable Power
Dissipation versus Ambient Temperature
P
(W)
tot
4
3
2
1
0
P
0
tot
3
2
1
0
4
-50
R
th j - amb
10
P
tot
0
(T
amb
20
= 70˚C)
50
30
40
100
G-3558
TDA1175P
l (mm)
T
G-3559/2
amb
(˚C)
R
(˚C/W)
80
60
40
20
0
th
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