74LVC245ABQ,115 NXP Semiconductors, 74LVC245ABQ,115 Datasheet
74LVC245ABQ,115
Specifications of 74LVC245ABQ,115
935273595115
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74LVC245ABQ,115 Summary of contents
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Octal bus transceiver; 3-state Rev. 05 — 25 August 2009 1. General description The 74LVC245A; 74LVCH245A are 8-bit transceivers featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The device features an output enable (OE) ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74LVC245AD +125 C 74LVCH245AD 74LVC245ADB +125 C 74LVCH245ADB 74LVC245APW +125 C 74LVCH245APW 74LVC245ABQ +125 C 74LVCH245ABQ 74LVC245ABX +125 C 74LVCH245ABX 4. Functional diagram DIR Fig 1. Logic diagram 74LVC_LVCH245A_5 Product data sheet 74LVC245A; 74LVCH245A Description SO20 plastic small outline package ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning 74LVC245A 74LVCH245A DIR GND Fig 3. Pin configuration for SO20 and (T)SSOP20 5.2 Pin description Table 2. Pin description Symbol Pin DIR GND 18, 17, 16, 15, 14, 13, 12 74LVC_LVCH245A_5 Product data sheet 74LVC245A; 74LVCH245A 001aak292 (1) The die substrate is attached to this pad using Fig 4 ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function selection Inputs OE DIR [ HIGH voltage level LOW voltage level don’t care high impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions C input capacitance I C input/output I/O capacitance I bus hold LOW V BHL CC current I bus hold HIGH V BHH CC current I bus hold LOW V BHLO CC overdrive current I bus hold HIGH ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter Conditions C power per buffer dissipation capacitance [ the same as t and PLH PHL t is the same as t and PZL PZH t is the same as t and t ...
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... NXP Semiconductors OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH See Table 8 for measurement points V and V are typical output voltage levels that occur with the output load Fig 6. Enable and disable times Table 8. Measurement points Supply voltage Input 1 2.7 V 2 ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance External voltage for measuring switching times. EXT Fig 7. Test circuit for measuring switching times Table 9. Test data ...
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... NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT339-1 Fig 9. ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors DHXQFN20U: plastic dual in-line compatible thermal enhanced extremely thin quad flat package; no leads; 20 terminals; UTLP based; body 2.5 x 4.5 x 0.5 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.30 4.6 mm 0.5 0.00 0.18 4 ...
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... New SOT1045-1 package outline drawing (DHXQFN20U package). Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Added type number 74LVC245ABX and 74LVCH245ABX (DHXQFN20U package) Product specifi ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 Revision history ...