74HC241N,652 NXP Semiconductors, 74HC241N,652 Datasheet - Page 5

IC BUFF/DVR TRI-ST DUAL 20DIP

74HC241N,652

Manufacturer Part Number
74HC241N,652
Description
IC BUFF/DVR TRI-ST DUAL 20DIP
Manufacturer
NXP Semiconductors
Series
74HCr
Datasheet

Specifications of 74HC241N,652

Logic Type
Buffer/Line Driver, Non-Inverting
Package / Case
20-DIP (0.300", 7.62mm)
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Mounting Type
Through Hole
Logic Family
74HC
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
125 C
Mounting Style
Through Hole
High Level Output Current
- 7.8 mA
Input Bias Current (max)
8 uA
Low Level Output Current
7.8 mA
Maximum Power Dissipation
750 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
10 / 8
Output Type
3-State
Propagation Delay Time
30 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-1419-5
74HC241N
933670530652
Philips Semiconductors
DC CHARACTERISTICS FOR 74HC
For the DC characteristics see
Output capability: bus driver
I
AC CHARACTERISTICS FOR 74HC
GND = 0 V; t
September 1993
CC
SYMBOL PARAMETER
t
t
t
t
PHL
PZH
PHZ
THL
Octal buffer/line driver; 3-state
category: MSI
/ t
/ t
/ t
/ t
TLH
PLH
PZL
PLZ
propagation delay
3-state output enable time
3-state output disable time
output transition time
r
= t
1A
2A
1OE to 1Y
2OE to 2Y
1OE to 1Y
2OE to 2Y
f
n
n
= 6 ns; C
to 1Y
to 2Y
n
n
n
n
n
n
;
;
;
L
= 50 pF
“74HC/HCT/HCU/HCMOS Logic Family Specifications”
min.
25
9
7
30
11
9
39
14
11
14
5
4
typ.
25
100
20
17
150
30
26
150
30
26
60
12
10
max.
5
T
amb
74HC
min.
40 to 85
( C)
125
25
21
190
38
33
190
38
33
75
15
13
max.
min. max.
40 to 125
150
30
26
225
45
38
225
45
38
90
18
15
.
UNIT
ns
ns
ns
ns
74HC/HCT241
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
TEST CONDITIONS
V
(V)
Product specification
CC
WAVEFORMS
Fig.5
Fig.6
Fig.6
Fig.5

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