T-M5.3 Infineon Technologies, T-M5.3 Datasheet
T-M5.3
Specifications of T-M5.3
Related parts for T-M5.3
T-M5.3 Summary of contents
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... T-M5.3 Wire Bond Globe Top Package For contact based application (Controller) Short Product Overview May 2010 Chip Card & Security ...
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... T-M5.3 Short Product Overview Revision History: Current Version 05.10 Previous Releases: Page Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Chip Card & Security E-Mail: security.chipcard.ics@infineon.com Edition 2010 Published by Infineon Technologies AG, Chip Card & Security 81726 Munich, Germany © ...
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... Thickness max. 580µm CIN+ Contact Surface Delivery form Tape on Reel Reel diameter 330mm ISO - reference ISO/IEC 7810 SO/IEC 7816-1 ISO/IEC 10373 Derivatives Information For further information on technology, delivery forms and conditions please contact your nearest Infineon Technologies sales representative (www.infineon.com). T-M5.3 T-M5.3 ...
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... Published by Infineon Technologies AG ...