T-M4.9 Infineon Technologies, T-M4.9 Datasheet

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T-M4.9

Manufacturer Part Number
T-M4.9
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of T-M4.9

Applications
Payment, Government Identification
Pitch
14.25 mm
Dimensions
13 x 11.8
Thickness (max.)
580.0 µm
Contact Surface
CIN
Wire Bond Globe Top Package
For contact based application (Controller)
T-M4.9
Short Product Overview
May 2010
Chip Card & Security

Related parts for T-M4.9

T-M4.9 Summary of contents

Page 1

... T-M4.9 Wire Bond Globe Top Package For contact based application (Controller) Short Product Overview May 2010 Chip Card & Security ...

Page 2

... T-M4.9 Short Product Overview Revision History: Current Version 05.10 Previous Releases: Page Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Chip Card & Security E-Mail: security.chipcard.ics@infineon.com Edition 2010 Published by Infineon Technologies AG, Chip Card & Security 81726 Munich, Germany © ...

Page 3

... CIN Contact Surface Delivery form Tape on Reel Reel diameter 330mm ISO - reference ISO/IEC 7810 SO/IEC 7816-1 ISO/IEC 10373 Derivatives T-M4.9-8-1, Au surface T-M4.9-8-2, Pd surface Information For further information on technology, delivery forms and conditions please contact your nearest Infineon Technologies sales representative (www.infineon.com). T-M4.9 T-M4.9 ...

Page 4

... Published by Infineon Technologies AG ...

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