T-M8.4 Infineon Technologies, T-M8.4 Datasheet

no-image

T-M8.4

Manufacturer Part Number
T-M8.4
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of T-M8.4

Applications
Payment, EMV SDA/DDA, ePurse, Loyalty, Access Control, Driver Licence, Transport
Pitch
14.25 mm
Dimensions
13 x 11.8
Thickness (max.)
580.0 µm
Contact Surface
NiAu / NiAuPd
Wire Bond Globe Top Package
For Dual Interface application (Controller)
T-M8.4
Sh o rt Pro d u c t O ve r vi e w
May 2010
Ch i p C a rd & Se c u ri t y

Related parts for T-M8.4

T-M8.4 Summary of contents

Page 1

... T-M8.4 Wire Bond Globe Top Package For Dual Interface application (Controller Pro May 2010 & ...

Page 2

... T-M8.4 Short Product Overview Revision History: Current Version 05.10 Previous Releases: Page Further information is confidential and on request. Please contact: Important: Infineon Technologies AG in Munich, Germany, Chip Card & Security E-Mail: security.chipcard.ics@infineon.com Edition 2010 Published by Infineon Technologies AG, Chip Card & Security 81726 Munich, Germany © ...

Page 3

... Contact Surface NiAu / NiAuPd Delivery form Tape on Reel Reel diameter 330mm ISO - reference ISO/IEC 7810 SO/IEC 7816-1 ISO/IEC 10373 Derivatives T-M8.4-8-1, Au surface T-M8.4-8-2, Pd surface T-M8.4-8-8, Information For further information on technology, delivery forms and conditions please contact your nearest Infineon Technologies sales representative (www.infineon.com). T-M8.4 La/Lb to C4/C8 T-M8.4 ...

Page 4

... Published by Infineon Technologies AG ...

Related keywords