BSL202SN Infineon Technologies, BSL202SN Datasheet - Page 2

• Manufacturer Part Number: BSL202SN
• Manufacturer: Infineon Technologies

Specifications of BSL202SN

• Package: TSOP-6
• Vds (max): 20.0 V
• Rds (on) (max) (@10v): -
• Rds (on) (max) (@4.5v): 22.0 mOhm
• Rds (on) (max) (@2.5v): 36.0 mOhm

Rev 1.08
1)
connection. PCB is vertical in still air. (t < 5 sec.)
Parameter
Thermal characteristics
Thermal resistance,
junction - minimal footprint
SMD version, device on PCB
Electrical characteristics, at T
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Drain-source leakage current
Gate-source leakage current
Drain-source on-state resistance
Transconductance
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
j
=25 °C, unless otherwise specified
Symbol Conditions
R
R
V
V
I
I
R
g
DSS
GSS
fs
(BR)DSS
GS(th)
thJS
thJA
DS(on)
minimal footprint
6 cm
V
V
V
T
V
T
V
V
V
|V
I
D
page 2
j
j
GS
DS
DS
DS
GS
GS
GS
=25 °C
=150 °C
=7.5 A
DS
=V
=20 V, V
=20 V, V
= 0 V, I
=12 V, V
=2.5 V, I
=4.5 V, I
|>2|I
2
cooling area
GS
, I
D
2
|R
D
(single layer, 70 µm thick) copper area for drain
D
=30 µA
= 250 µA
D
D
GS
GS
DS
DS(on)max
=5.9 A
=7.5 A
=0 V,
=0 V,
=0 V
1)
,
min.
0.7
20
-
-
-
-
-
-
-
-
Values
0.95
typ.
26
17
25
-
-
-
-
-
-
-
max.
62.5
230
100
100
1.2
50
36
22
BSL202SN
1
-
-
Unit
K/W
V
μA
nA
mΩ
S
2011-05-23