STN1NB80 STMicroelectronics, STN1NB80 Datasheet

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STN1NB80

Manufacturer Part Number
STN1NB80
Description
Manufacturer
STMicroelectronics
Datasheet

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Part Number:
STN1NB80
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STN1NB80
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Part Number:
STN1NB80,1NB80
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DESCRIPTION
Using the latest high voltage MESH OVERLAY
process, STMicroelectronics has designed an
advanced family of power MOSFETs with
outstanding performances. The new patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest R
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS
( ) Pulse width limited by safe operating area
November 1999
ST N1NB80
Symbol
dv/dt(
FOR HANDHELD EQUIPMENT
I
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
SWITCH MODE POWER SUPPLIES (SMPS)
AC ADAPTORS AND BATTERY CHARGERS
V
DM
V
V
T
P
DGR
I
I
T
GS
s tg
DS
D
D
tot
TYPE
( )
j
1
)
DS(on)
Drain-source Voltage (V
Drain- gate Voltage (R
G ate-source Voltage
Drain Current (continuous) at T
Drain Current (continuous) at T
Drain Current (pulsed)
T otal Dissipation at T
Derating Factor
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction Temperature
DS(on)
per area, exceptional avalanche
800 V
V
= 16
DSS
N - CHANNEL 800V - 16
R
< 20
DS(on)
c
Parameter
GS
= 25
GS
= 20 k )
= 0)
o
C
c
c
0.2 A
= 25
= 100
I
D
o
C
o
C
(
1
) I
SD
PowerMESH
INTERNAL SCHEMATIC DIAGRAM
0.2 A, di/dt
2
200 A/ s, V
- 0.2A - SOT-223
-65 to 150
SOT-223
Value
0.12
0.02
800
800
150
0.2
0.8
2.9
DD
4
30
STN1NB80
V
1
(BR)DSS
2
MOSFET
, Tj
3
T
JMAX
W /
Un it
V/ns
o
o
W
V
V
V
A
A
A
C
C
o
C

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STN1NB80 Summary of contents

Page 1

... Max. Operating Junction Temperature Pulse width limited by safe operating area November 1999 - 0.2A - SOT-223 PowerMESH SOT-223 INTERNAL SCHEMATIC DIAGRAM Value 100 -65 to 150 ( ) I 0.2 A, di/dt 200 STN1NB80 MOSFET 800 V 800 0.2 A 0.12 A 0 ...

Page 2

... STN1NB80 THERMAL DATA R Thermal Resistance Junction-case thj -case Thermal Resistance Junction-ambient Rthj -amb R Thermal Resistance Case-sink thc-sink T Maximum Lead Temperature For Soldering Purpose l AVALANCHE CHARACTERISTICS Symbo l Parameter I Avalanche Current, Repetitive or Not-Repetitive AR (pulse width limited by T max Single Pulse Avalanche Energy ...

Page 3

... GS Test Con ditions Min. = 640 1 4 Test Con ditions Min. =0 1.1 A di/dt = 100 100 150 C j Thermal Impedance STN1NB80 T yp. Max. Unit 3 yp. Max. Unit yp. Max. Unit ...

Page 4

... STN1NB80 Output Characteristics Transconductance Gate Charge vs Gate-source Voltage 4/8 Transfer Characteristics Static Drain-source On Resistance Capacitance Variations ...

Page 5

... Normalized Gate Threshold Voltage vs Temperature Source-drain Diode Forward Characteristics STN1NB80 Normalized On Resistance vs Temperature 5/8 ...

Page 6

... STN1NB80 Fig. 1: Unclamped Inductive Load Test Circuit Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/8 Fig. 2: Unclamped Inductive Waveform Fig. 4: Gate Charge test Circuit ...

Page 7

... SOT-223 MECHANICAL DATA mm DIM. MIN. TYP. MAX. a 2.27 2.3 b 4.57 4.6 c 0.2 0.4 d 0.63 0.65 e1 1 0.67 0 3.5 3.5 L 6.3 6 mils MIN. TYP. MAX. 2.33 89.4 90.6 4.63 179.9 181.1 182.3 0.6 7.9 15.7 0.67 24.8 25.6 1.7 59.1 63 0.32 3.1 114.2 118.1 122.1 0.73 26.4 27.6 7.3 263.8 275.6 287.4 3.7 137.8 137.8 145.7 6.7 248 255.9 263 P008B STN1NB80 91.7 23.6 26.4 66.9 12.6 28.7 7/8 ...

Page 8

... STN1NB80 Information furnished is believed to be accurate and reliable. However, STMicroelect r onics assumes no responsibil ity for the consequences of use of such information nor for any infringement of patents or other rights of third part i es which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectro nics. Specific ation mentioned in this publication are subjec t to change without notice ...

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