STW9NB80 STMicroelectronics, STW9NB80 Datasheet

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STW9NB80

Manufacturer Part Number
STW9NB80
Description
Manufacturer
STMicroelectronics
Datasheet

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STW9NB80
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Part Number:
STW9NB80
Manufacturer:
ST
Quantity:
12 500
Part Number:
STW9NB80
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DESCRIPTION
Using the latest high voltage MESH OVERLAY
process, STMicroelectronics has designed an
advanced family of power MOSFETs with
outstanding performances. The new patent
pending strip layout coupled with the Company’s
proprietary edge termination structure, gives the
lowest RDS(on) per area, exceptional avalanche
and dv/dt capabilities and unrivalled gate charge
and switching characteristics.
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS
( ) Pulse width limited by safe operating area
July 1999
STW 9NB80
Symbol
dv/dt(
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
I
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
HIGH CURRENT, HIGH SPEED SWITCHING
SWITCH MODE POWER SUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
V
DM
V
V
T
P
DGR
I
I
30V GATE TO SOURCE VOLTAGE RATING
T
GS
s tg
DS
D
D
tot
TYPE
( )
j
1
)
Drain-source Voltage (V
Drain- gate Voltage (R
G ate-source Voltage
Drain Current (continuous) at T
Drain Current (continuous) at T
Drain Current (pulsed)
T otal Dissipation at T
Derating Factor
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction Temperature
DS(on)
800 V
V
= 0.85
DSS
N-CHANNEL 800V - 0.85 - 9.3A - TO-247
R
< 1
DS(on)
c
Parameter
GS
= 25
GS
= 20 k )
= 0)
o
C
c
c
9.3 A
= 25
= 100
I
D
o
C
o
C
(1) I
SD
PowerMESH
INTERNAL SCHEMATIC DIAGRAM
9.3A, di/dt
200A/ s, V
-65 to 150
TO-247
Value
1.52
DD
800
800
190
150
9.3
5.8
37
4
30
STW9NB80
V
(BR)DSS
1
2
, Tj
MOSFET
3
T
JMAX
W /
Un it
V/ns
o
o
W
V
V
V
A
A
A
C
C
o
C
1/8

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STW9NB80 Summary of contents

Page 1

... T Max. Operating Junction Temperature Pulse width limited by safe operating area July 1999 PowerMESH I D 9.3 A TO-247 INTERNAL SCHEMATIC DIAGRAM Value 100 -65 to 150 (1) I 9.3A, di/dt 200A STW9NB80 MOSFET 800 V 800 9 190 V/ns o ...

Page 2

... STW9NB80 THERMAL DATA R Thermal Resistance Junction-case thj -case R Thermal Resistance Junction-ambient thj -amb R Thermal Resistance Case-sink thc-sink T Maximum Lead Temperature For Soldering Purpose l AVALANCHE CHARACTERISTICS Symbo l Parameter I Avalanche Current, Repetitive or Not-Repetitive AR (pulse width limited by T max Single Pulse Avalanche Energy ...

Page 3

... Test Con ditions Min. = 640 4 Test Con ditions Min 9.3 A di/dt = 100 100 150 C j Thermal Impedance STW9NB80 T yp. Max. Unit yp. Max. Unit yp. Max. ...

Page 4

... STW9NB80 Output Characteristics Transconductance Gate Charge vs Gate-source Voltage 4/8 Transfer Characteristics Static Drain-source On Resistance Capacitance Variations ...

Page 5

... Normalized Gate Threshold Voltage vs Temperature Source-drain Diode Forward Characteristics STW9NB80 Normalized On Resistance vs Temperature 5/8 ...

Page 6

... STW9NB80 Fig. 1: Unclamped Inductive Load Test Circuit Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/8 Fig. 2: Unclamped Inductive Waveform Fig. 4: Gate Charge test Circuit ...

Page 7

... DIM. MIN. TYP. A 4.7 D 2 10.9 H 15.3 L 19.7 L3 14.2 L4 34 inch MAX. MIN. TYP. 5.3 0.185 2.6 0.087 0.8 0.016 1.4 0.039 2.4 0.079 3.4 0.118 0.429 15.9 0.602 20.3 0.776 14.8 0.559 1.362 0.217 3 0.079 STW9NB80 MAX. 0.209 0.102 0.031 0.055 0.094 0.134 0.626 0.779 0.582 0.118 P025P 7/8 ...

Page 8

... STW9NB80 Information furnished is believed to be accurate and reliable. However, STMicroelect r onics assumes no responsibil ity for the consequences of use of such information nor for any infringement of patents or other rights of third part i es which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectro nics. Specific ation mentioned in this publication are subjec t to change without notice ...

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