74AHCT1G07GW,125 NXP Semiconductors, 74AHCT1G07GW,125 Datasheet
74AHCT1G07GW,125
Specifications of 74AHCT1G07GW,125
74AHCT1G07GW-G
935267471125
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74AHCT1G07GW,125 Summary of contents
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Buffer with open-drain output Rev. 06 — 7 June 2007 1. General description 74AHC1G07 and 74AHCT1G07 are high-speed Si-gate CMOS devices. They provide a non-inverting buffer. The output of these devices is open-drain and can be connected to ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74AHC1G07GW 74AHC1G07GV 74AHCT1G07GW 74AHCT1G07GV 5. Functional diagram mna589 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin n. GND 74AHC_AHCT1G07_6 Product data sheet 74AHC1G07; 74AHCT1G07 ...
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... NXP Semiconductors 7. Functional description Table 4. Function table H = HIGH voltage level LOW voltage level high-impedance OFF-state Input Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I I input clamping current ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions For type 74AHC1G07 V HIGH-level input voltage LOW-level input voltage LOW-level output voltage 4.0 mA 8.0 mA input leakage GND current 5 OFF-state output current GND ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 3.0 ns. For test circuit see r f Symbol Parameter Conditions For type 74AHC1G07 t OFF-state see PZL to LOW V CC propagation C delay LOW see PLZ OFF-state V CC propagation C delay power per buffer; PD dissipation pF MHz; L capacitance V = GND to V ...
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... NXP Semiconductors 12. Waveforms A input Y output Measurement points are given in Fig 5. Input (A) to output (Y) propagation delays Table 9. Measurement point Type Input V I 74AHC1G07 GND to V 74AHCT1G07 GND to 3.0 V GENERATOR Test data is given in Table 8. Definitions for test circuit Load capacitance including jig and probe capacitance. ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 7 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74AHC_AHCT1G07_6 Product data sheet 74AHC1G07; 74AHCT1G07 scale 3.1 1.7 3.0 0.6 0.95 2 ...
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... Release date 74AHC_AHCT1G07_6 20070607 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT353 changed to SOT353-1 in • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 Abbreviations ...