HEF4050BT,652 NXP Semiconductors, HEF4050BT,652 Datasheet - Page 18

• Manufacturer Part Number: HEF4050BT,652
• Description: IC BUFFER HEX NON-INV 16SOICN
• Manufacturer: NXP Semiconductors
• Series: 4000Br

Specifications of HEF4050BT,652

• Logic Type: Buffer/Line Driver, Non-Inverting
• Package / Case: 16-SOIC (3.9mm Width)
• Number Of Elements: 6
• Number Of Bits Per Element: 1
• Current - Output High, Low: 3.4mA, 20mA
• Voltage - Supply: 3 V ~ 15 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: HE4000B
• Number Of Channels Per Chip: 6
• Polarity: Non-Inverting
• Supply Voltage (max): 15 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 3.6 mA (Min)
• Input Bias Current (max): 16 uA
• Low Level Output Current: 24 mA (Min)
• Maximum Power Dissipation: 500 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 6 / 6
• Propagation Delay Time: 55 ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1688-5; 933372930652; HEF4050BTD

Philips Semiconductors
January 1995
DIP24: plastic dual in-line package; 24 leads (600 mil)
Package information
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
SOT101-1
VERSION
OUTLINE
L
max.
0.20
5.1
A
Z
24
1
0.020
min.
0.51
A
1
pin 1 index
051G02
IEC
max.
0.16
4.0
A
2
0.066
0.051
1.7
1.3
b
e
MO-015AD
D
0.021
0.015
0.53
0.38
JEDEC
b
1
REFERENCES
0.013
0.009
0.32
0.23
c
0
b
32.0
31.4
1.26
1.24
D
(1)
scale
EIAJ
18
5
13
b
12
14.1
13.7
0.56
0.54
1
E
(1)
A
10 mm
1
w
2.54
0.10
M
e
A
E
2
A
15.24
0.60
e
1
0.15
0.13
3.9
3.4
L
c
PROJECTION
EUROPEAN
15.80
15.24
0.62
0.60
M
Package outlines
E
(e )
M
M
H
1
E
17.15
15.90
0.68
0.63
M
H
ISSUE DATE
0.25
0.01
92-11-17
95-01-23
w
SOT101-1
max.
0.087
2.2
Z
(1)