TS4998 STMicroelectronics, TS4998 Datasheet
TS4998
Related parts for TS4998
TS4998 Summary of contents
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... LCD monitors and TVs ■ Portable audio devices Description The TS4998 is designed for top-class stereo audio applications. Thanks to its compact and power-dissipation efficient QFN16 package with exposed pad, it suits a variety of applications. With a BTL configuration, this audio power amplifier is capable of delivering 1W per channel of continuous RMS output power into an 8Ω ...
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... Common mode feedback loop limitations . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.5 Low frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.6 Power dissipation and efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.7 Footprint recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.8 Decoupling of the circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4.9 Standby control and wake-up time t 4.10 Shutdown time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.11 Pop performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 4.12 Single-ended input configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 4.13 Notes on PSRR measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 5 QFN16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2/ TS4998 ...
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... TS4998 1 Typical application schematics Figure 1 shows a typical application for the TS4998 with a gain of +6dB set by the input resistors. Figure 1. Typical application schematics Optional Diff. input L- Cin1 P1 330nF Cin2 P2 Diff. input L+ 330nF Diff. input R- Cin3 P3 330nF Cin4 P4 Diff. input R+ 330nF Table 1. External component descriptions ...
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... GND - -65 to +150 150 120 Internally limited 2 1.5 200 200 + 0.3V / GND - 0.3V. Value 2.7 to 5.5 GND 1.3 ≤ V ≤ V STBY CC GND ≤ V ≤0.4 STBY ≥ 4 ≥ 1 150 45 85 TS4998 Unit V V °C °C °C °C Unit Ω MΩ °C °C/W ...
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... TS4998 3 Electrical characteristics Table +5V, GND = 0V Symbol Supply current input signal, no load, left and right channel active (1) Standby current I STBY No input signal, V STBYL Output offset voltage input signal 8Ω L Output power P o THD = 1% max 1kHz, R Total harmonic distortion + noise ...
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... R = 8Ω 8Ω 6dB L = 8Ω, G=6dB L = 500pF L = 8Ω tied to GND. )/rms(V )). V is the sinusoidal signal superimposed upon V out ripple ripple )/rms(V )). out incm TS4998 Min. Typ. Max. Unit 6.6 8 2000 370 460 mW 0 ...
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... TS4998 Table +2.7V, GND = 0V Symbol Supply current input signal, no load, left and right channel active (1) Standby current I STBY No input signal, V STBYL Output offset voltage input signal 8Ω L Output power P o THD = 1% max 1kHz, R Total harmonic distortion + noise ...
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... Figure 36 page 14 Figure page 14 to page 15 Figure page 15 to page 16 Figure page 16 Figure 49 page 16 Figure page 17 Figure 53 page 17 Figure page 17 to page 18 Figure 57 page 18 Figure page 18 Figure page 18 to page 19 Figure 63 page 19 TS4998 ...
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... TS4998 Figure 2. THD+N vs. output power 10 Ω +6dB F = 1kHz μ < 125kHz 1 ° Tamb = 25 C Vcc=2.7V 0.1 0.01 1E-3 0.01 Output power (W) Figure 4. THD+N vs. output power 10 Ω +6dB F = 1kHz μ < 125kHz 1 ° Tamb = 25 C Vcc=2.7V 0.1 0.01 1E-3 0.01 Output power (W) Figure 6. THD+N vs. output power 10 Ω ...
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... BW < 125kHz ° Tamb = 25 C Vcc=2.7V 0.01 0.1 Output power (W) Ω +12dB Vcc= 10kHz μ < 125kHz Vcc=3.3V ° Tamb = 25 C Vcc=2.7V 0.01 0.1 Output power (W) Ω +12dB Vcc= 10kHz μ < 125kHz ° Vcc=3.3V Tamb = 25 C Vcc=2.7V 0.01 0.1 Output power (W) TS4998 ...
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... TS4998 Figure 14. THD+N vs. frequency 10 Ω +6dB μ < 125kHz ° Tamb = 0.1 0.01 100 Frequency (Hz) Figure 16. THD+N vs. frequency 10 Ω +6dB μ < 125kHz ° Tamb = Vcc=2.7V Pout=200mW 0.1 0.01 100 Frequency (Hz) Figure 18. THD+N vs. frequency 10 Ω +6dB μ < ...
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... Inputs Grounded ° Tamb = 25 C 100 1000 Frequency (Hz) Vcc = 3.3V Vripple = 200mVpp G = +6dB μ μ Cin = 4.7 F Inputs Grounded ° Tamb = 25 C 100 1000 Frequency (Hz) Vcc = 3.3V Vripple = 200mVpp μ Inputs Floating ° Tamb = 25 C 100 1000 Frequency (Hz) TS4998 10000 10000 10000 ...
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... TS4998 Figure 26. PSRR vs. frequency 0 Vcc = 2.7V -10 Vripple = 200mVpp G = +6dB -20 μ μ Cin = 4.7 F -30 Inputs Grounded ° Tamb = 25 C -40 -50 -60 -70 -80 -90 -100 100 Frequency (Hz) Figure 28. PSRR vs. frequency 0 Vcc = 2.7V -10 Vripple = 200mVpp μ -20 Inputs Floating -30 ° Tamb = 25 C -40 -50 -60 -70 -80 -90 ...
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... Tamb = 25°C 100 1000 Frequency (Hz) Vcc = 2.7V ≥ Ω +12dB Vic = 200mVpp μ μ Cin = 4.7 F Tamb = 25°C 100 1000 Frequency (Hz) Ω +6dB μ μ Cin = ° Tamb = 25 C Vcc=5V Vcc=3.3V Vcc=2.7V 100 1000 Frequency (Hz) TS4998 10000 10000 10000 ...
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... TS4998 Figure 38. Crosstalk vs. frequency 0 Ω - +6dB -20 μ μ Cin = -30 ° Tamb = 25 C -40 -50 Vcc=5V -60 Vcc=3.3V -70 Vcc=2.7V -80 -90 -100 -110 -120 100 Frequency (Hz) Figure 40. SNR vs. power supply voltage 110 108 106 104 102 100 2.5 3.0 3.5 4.0 Supply Voltage (V) Figure 42 ...
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... F = 1kHz Ω +6dB THD + N < 0.5% ° Tamb = 25 C 3.0 3.5 4.0 4.5 Supply Voltage (V) common mode input voltage G = +6dB ° Tamb = 25 C 0.5 1.0 1.5 2.0 Common Mode Input Voltage (V) supply voltage No load ° Tamb = 25 C Both channels active One channel active Power Supply Voltage (V) TS4998 5.0 5.5 2.5 3.0 5 ...
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... TS4998 Figure 50. Current consumption vs. standby voltage Both channels active One channel active Standby Voltage (V) Figure 52. Current consumption vs. standby voltage 0.0 0.5 1.0 1.5 Standby Voltage (V) Figure 54. Frequency response 14 13 μ Ω Cin=4.7 F, Rin=12k Ω ...
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... < 125 kHz ° Tamb = 25 C Ω RL=4 RL=8 3.0 3.5 4.0 4.5 Vcc (V) Ω RL=8 Ω RL=16 0 100 200 300 400 500 Output Power (mW) TS4998 THD 1kHz μ < 125kHz ° Tamb = Ω Ω RL=16 Ω RL=32 5.0 5.5 Ω RL=4 Vcc = 3. 1kHz THD+N < 1% 600 700 ...
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... TS4998 Figure 62. Power dissipation vs. output power Figure 63. Power derating curves 400 350 300 250 200 150 Ω RL=16 100 100 150 200 250 Output Power (mW) 3.0 2.8 2.6 Ω RL=4 2.4 2.2 2.0 Ω RL=8 1.8 1.6 1.4 1.2 1.0 0.8 0.6 Vcc = 2.7V 0 1kHz No Heat sink -AMR value 0.2 THD+N < 1% 0.0 0 300 350 400 450 Electrical characteristics ...
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... Differential configuration principle The TS4998 also includes a common mode feedback loop that controls the output bias value to average output voltage swing, and therefore, to maximize the output power. Moreover, as the load is connected differentially instead of single-ended, output power is four times higher for the same power supply voltage ...
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... TS4998 Due to the tolerance on the internal 50kΩ feedback resistors, the differential gain will be in the range (no tolerance on R The difference of resistance between input resistors of each channel have direct influence on the PSRR, CMRR and other amplifier parameters. In order to reach maximum performance, we recommend matching the input resistors R maximum tolerance of 1% ...
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... R IN expressed ----------------------------------------------- - × π × value required for cut-off frequency IN 100 Ω Rin=12k G~12dB 10 Ω Rin=24k G~6dB 0.1 0.2 Input Capacitor Cin ( and R form a first-order high × ° Tamb=25 C Ω Rin=6.2k G~18dB 0.4 0.6 0.8 1 μ F) TS4998 ...
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... TS4998 4.6 Power dissipation and efficiency Assumptions: ● Load voltage and current are sinusoidal (V ● Supply voltage is a pure DC source (V The output voltage is: and and Therefore, the average current delivered by the supply voltage is: Equation 3 The power delivered by the supply voltage is: Equation 4 Therefore, the power dissipated by each amplifier is: ...
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... The efficiency is the ratio between the output power and the power supply: Equation 6 The maximum theoretical value is reached when V The TS4998 is stereo amplifier so it has two power amplifiers. Each amplifier produces heat due to its power dissipation. Therefore, the maximum die temperature is the sum of each amplifier’s maximum power dissipation calculated as follows: ● ...
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... For proper thermal conductivity, the vias must be plated through and solder-filled. Typical thermal vias have the following dimensions: 1.2mm pitch, 0.3mm diameter. Figure 65. QFN16 footprint recommendation 4.8 Decoupling of the circuit Two capacitors are needed to correctly bypass the TS4998: a power supply bypass capacitor C and a bias voltage bypass capacitor C S The C ...
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... R - pins are shorted to ground by internal switches. This allows a quick discharge capacitors. IN 4.11 Pop performance Due to its fully differential structure, the pop performance of the TS4998 is close to perfect. However, due to mismatching between internal resistors R 26/ STBYL STBYR starts to be charged. Because C b and is specified establish the corresponding wake-up time ...
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... C mismatched components, the TS4998 includes pop reduction circuitry. With this circuitry, the TS4998 is close to zero pop for all possible common applications. In addition, when the TS4998 is in standby mode, due to the high impedance output stage in this configuration, no pop is heard. 4.12 Single-ended input configuration It is possible to use the TS4998 in a single-ended input configuration ...
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... TS4998 Rin2 LEFT Rin3 4 RIN- RIGHT 3 RIN+ Rin4 14 Bypass BIAS STBY GND GND 1uF fixed fixed ripple is used S RMS ( × Output PSRR 20 Log = --------------------------------- - RMS ( Vripple TS4998 Vripple Vcc Vcc 12 LOUT 8Ohms 11 LOUT ROUT 8Ohms 10 ROUT+ + TS4998 - QFN16 ) ( ) dB ) ...
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... TS4998 5 QFN16 package information In order to meet environmental requirements, STMicroelectronics offers these devices in ® ECOPACK packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... QFN16 package information Figure 71. QFN16 4x4mm package mechanical data * The Exposed Pad is connected to Ground. * The Exposed Pad is connected to Ground. Figure 72. QFN16 footprint soldering pad 30/33 Dimensions Millimeters (mm) Ref Min A 0 0. 2.1 E 3. 0.2 L 0.30 r 0.11 Ref TS4998 Typ Max 0.9 1.0 0.02 0.05 0.20 0.25 0.30 4.0 4.15 2.6 4.0 4.15 2.6 0.65 0.40 0.50 Footprint data mm A 4.2 B 4.2 C 0.65 D 0.35 E 0.65 F 2.70 ...
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... TS4998 6 Ordering information Table 8. Order codes Order code TS4998IQT Temperature range Package -40°C to +85°C QFN16 4x4mm Ordering information Packaging Marking Tape & reel K998 31/33 ...
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... Revision history 7 Revision history Table 9. Document revision history Date 20-Dec-2007 32/33 Revision 1 Initial release. TS4998 Changes ...
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... TS4998 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...