BGB101 NXP Semiconductors, BGB101 Datasheet - Page 14

• Manufacturer Part Number: BGB101
• Description: 0 Dbm Bluetooth Radio Module
• Manufacturer: NXP Semiconductors

Philips Semiconductors
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210 C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering is not recommended because of the nature
of the contacts.
The maximum allowed temperature is 250 C for a
maximum of 5 seconds.
The maximum ramp-up is 10 C per second.
The maximum cool-down is 5 C per second.
Cleaning
The following fluids may be used for cleaning:
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
2003 Aug 05
Alcohol
Bio-Act (Terpene Hydrocarbon)
Acetone.
0 dBm Bluetooth radio module
14
Packing
An extended packing / SMD specification can be found in
document SC-18 “Discrete Semiconductor Packages”.
.
The module is compliant with moisture sensitivity level 1.
handbook, halfpage
Fig.6 Recommended reflow temperature profile.
( C)
300
200
100
T
0
0
1
2
3
Preliminary specification
4
t (min)
BGB101
MGM159
5