NZH3V0B NXP Semiconductors, NZH3V0B Datasheet

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NZH3V0B

Manufacturer Part Number
NZH3V0B
Description
Single Zener Diodes
Manufacturer
NXP Semiconductors
Datasheet

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1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted
Device (SMD) plastic package.
Table 1.
[1]
[2]
[3]
Symbol
V
P
F
tot
NZH series
Single Zener diodes
Rev. 01 — 27 January 2010
Total power dissipation: ≤ 500 mW
Wide working voltage range
General regulation functions
Pulse test: t
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm
Device mounted on a ceramic PCB, Al
Quick reference data
Parameter
forward voltage
total power dissipation
p
≤ 300 μs; δ ≤ 0.02.
2
.
2
O
3
, standard footprint.
Conditions
I
T
F
amb
= 10 mA
≤ 25 °C
Small plastic package suitable for
surface-mounted design
Low differential resistance
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
Product data sheet
Max
0.9
500
1
Unit
V
mW
W

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NZH3V0B Summary of contents

Page 1

NZH series Single Zener diodes Rev. 01 — 27 January 2010 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features Total power dissipation: ≤ 500 mW ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number NZH3V0B to NZH30C [1] The series consists of 25 types with nominal working voltages from 3 Marking Table 4. Type number NZH3V0B NZH3V3A NZH3V6B NZH3V9B NZH4V3B ...

Page 3

... Characteristics C unless otherwise specified. Parameter Conditions forward voltage ≤ 300 μs; δ ≤ 0.02. p Characteristics per type; NZH3V0B to NZH10C C unless otherwise specified. Working voltage Maximum differential V (V); resistance (Ω) Z dif Min ...

Page 4

... MHz; V Table 10. ° NZHxxx 22C 24C 27C 30C [ MHz; V NZH_SER_1 Product data sheet Characteristics per type; NZH3V0B to NZH10C C unless otherwise specified. Working voltage Maximum differential V (V); resistance (Ω) Z dif Min Max 4.17 4 ...

Page 5

... NXP Semiconductors = 25 ° Fig 1. Forward current as a function of forward voltage; typical values 50 V (V) = 3.0 Z(nom (mA) 3.3 40 3.6 3.9 5 ° Fig 2. Working current as a function of working voltage; typical values NZH_SER_1 Product data sheet 300 I F (mA) 200 100 0 0.6 0.8 006aac010 (mA) 9 ...

Page 6

... Fig 4. 9. Packing information Table 11. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package NZH3V0B to NZH30C [1] For further information and the availability of packing methods, see [2] The series consists of 25 types with nominal working voltages from 3 ...

Page 7

... NXP Semiconductors 11. Revision history Table 12. Revision history Document ID Release date NZH_SER_1 20100127 NZH_SER_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 27 January 2010 NZH series Single Zener diodes Supersedes - © NXP B.V. 2010. All rights reserved ...

Page 8

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 9

... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information . . . . . . . . . . . . . . . . . . . . . 6 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Legal information ...

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