BUJ105AB NXP Semiconductors, BUJ105AB Datasheet

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BUJ105AB

Manufacturer Part Number
BUJ105AB
Description
Silicon Diffused Power Transistor
Manufacturer
NXP Semiconductors
Datasheet
1.BUJ105AB.pdf (7 pages)

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
BUJ105AB
Manufacturer:
NXP
Quantity:
60 000
Company:
Meier Automation Equipment Co., Limited Meier Automation Equipment Co., Limited
Part Number:
BUJ105AB
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
GENERAL DESCRIPTION
High-voltage, high-speed planar-passivated npn power switching transistor in SOT404 (D
package intended for use in high frequency electronic lighting ballast applications, converters, inverters, switching
regulators, motor control systems, etc.
QUICK REFERENCE DATA
PINNING - SOT404
LIMITING VALUES8
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
THERMAL RESISTANCES
October 2001
Silicon Diffused Power Transistor
SYMBOL
V
V
V
I
I
P
V
h
t
SYMBOL
V
V
V
I
I
I
I
P
T
T
SYMBOL
R
R
C
CM
f
C
CM
B
BM
PIN
FEsat
CESM
CBO
CEO
tot
CEsat
mb
CESM
CEO
CBO
tot
stg
j
th j-mb
th j-a
1
2
3
base
collector
emitter
collector
PARAMETER
Collector-emitter voltage peak value
Collector-Base voltage (open emitter)
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Total power dissipation
Collector-emitter saturation voltage
Fall time
PARAMETER
Collector to emitter voltage
Collector to emitter voltage (open base)
Collector to base voltage (open emitter)
Collector current (DC)
Collector current peak value
Base current (DC)
Base current peak value
Total power dissipation
Storage temperature
Junction temperature
PARAMETER
Thermal resistance junction to mounting
base
Thermal resistance junction to ambient
DESCRIPTION
PIN CONFIGURATION
1
2
3
CONDITIONS
V
T
I
I
I
CONDITIONS
V
T
CONDITIONS
minimum footprint, FR4 board
C
C
C
mb
mb
BE
BE
1
= 4.0 A;I
= 4.0 A; V
= 5 A; I
= 0 V
= 0 V
mb
25 ˚C
25 ˚C
B1
B
= 1 A
= 0.8 A
CE
= 5 V
SYMBOL
2
-PAK) surface-mount
b
TYP.
TYP.
MIN.
Product specification
0.3
-65
11
20
55
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
BUJ105AB
MAX.
MAX.
MAX.
e
c
700
700
400
125
700
400
700
125
150
150
1.0
1.0
16
15
50
16
8
8
4
8
-
Rev 1.000
UNIT
UNIT
UNIT
K/W
K/W
W
ns
W
˚C
˚C
V
V
V
A
A
V
V
V
V
A
A
A
A

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BUJ105AB Summary of contents

Page 1

... I = 4.0 A PIN CONFIGURATION CONDITIONS ˚C mb CONDITIONS minimum footprint, FR4 board 1 Product specification BUJ105AB 2 -PAK) surface-mount TYP. MAX. UNIT - 700 V - 700 V - 400 125 W 0.3 1 ...

Page 2

... CONDITIONS Con Bon Boff ohms BB2 Con Bon - Con Bon - 100 ˚ Product specification BUJ105AB MIN. TYP. MAX 400 - - - 0.3 1.0 - 1.0 1 TYP ...

Page 3

... VCEOsust . CEOsust = 300 V; -V VCC VCC T.U. Fig.6. Switching times waveforms with inductive load 0.01. p requirements. Bon 3 Product specification BUJ105AB ICon ton toff IBon 30ns -IBoff VCC LC LB Fig.5. Test circuit inductive load 200 uH ...

Page 4

... Fig.12. Collector-Emitter saturation voltage Solid lines = typ values Product specification VCEsat/V 2.0 1.6 IC= 1.2 0.8 0.4 0.0 0.01 0.10 1.00 IB/A = f(IB); T CEsat VBESAT/V 1.4 1.3 1.2 1.1 1 0.9 -40C 0.8 Tj=100C 25C 0.7 0.6 0.5 0.1 0 IC/A Fig.11. Base-Emitter saturation voltage. = f(IC); at IC/IB =4. BEsat VCESAT/V 0.6 0.5 Tj=100C 0.4 0.3 25C 0.2 0.1 0 0.2 0.4 0 IC/A = f(IC); at IC/IB =4. CEsat BUJ105AB 10.00 =25˚ -40C 5 6 Rev 1.000 ...

Page 5

... Fig.15. Reverse bias safe operating area ( VCC VCL(RBSOAR) PROBE POINT T.U.T. = 5V,3V & 1V Product specification IC 100 200 300 400 500 600 VCEclamp/V for -V = 5V,3V & 1V. BE BUJ105AB -5V -3V -1V 700 800 < jmax Rev 1.000 ...

Page 6

... Dimensions in mm Net Mass: 1.4 g 2.54 (x2) MOUNTING INSTRUCTIONS Dimensions in mm Notes 1. Plastic meets UL94 V0 at 1/8". October 2001 10.3 max 11 max 15.4 0.85 max (x2) Fig.16. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.17. SOT404 : soldering pattern for surface mounting. 6 Product specification BUJ105AB 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.000 ...

Page 7

... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 7 Product specification BUJ105AB Rev 1.000 ...

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