BUJ303AX NXP Semiconductors, BUJ303AX Datasheet

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... 0 =2.5 A,I =0 PIN CONFIGURATION case CONDITIONS ˚C hs CONDITIONS with heatsink compound in free air 1 Product specification BUJ303AX TYP. MAX. UNIT - 1000 V - 1000 V - 500 0.25 1 145 160 ns SYMBOL ...

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... CONDITIONS Con Bon ohms BB2 Con Bon - 2 0 Con Bon - 100 ˚ Product specification BUJ303AX MIN. TYP. MAX. - 2500 - 10 - MIN. TYP. MAX 0.1 500 - - - 0.25 1.5 - 0.97 1 ...

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... VCEOsust . CEOsust V = 300 VCC T.U. Fig. 6. Switching times waveforms with inductive load 0.01. p requirements. Bon 3 Product specification BUJ303AX ICon ton toff IBon 30ns -IBoff VCC LC LB T.U.T. Fig. 5. Test circuit inductive load 200 uH ...

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... Normalised Derating with heatsink compound 100 120 140 = Solid lines = typ values f(I ) Fig.11. Collector-Emitter saturation voltage Solid lines = typ values, V 0.001 1.00 10.00 = f(IB); T =25˚ Product specification BUJ303AX VBEsat/V 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.1 1.0 IC/A Fig.10. Base-Emitter saturation voltage. = f(IC); at IC/IB =4. BEsat VCEsat/V 0.5 0.4 0.3 0.2 0.1 0 IC/A = f(IC); at IC/IB =4. ...

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... LC VCL T.U. H 0.01 Fig.15. Forward bias safe operating area. T (1) ( III 1,200 800 1,000 NB max 5 Product specification BUJ303AX 0.01 ICM max 10 IC max II ( (2) 0.1 III 1 10 100 max and P peak max lines. tot tot Second breakdown limits. ...

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... Fig.16. SOT186A; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1998 10.3 max 3.2 3.0 2.8 seating 15.8 19 max. max. plane 3 2 2.54 0.5 5.08 6 Product specification BUJ303AX 4.6 max 2.9 max 6.4 15.8 max 0.6 2.5 1.0 (2x) 0.9 0.7 1.3 Rev 1.000 ...

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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1998 7 Product specification BUJ303AX Rev 1.000 ...