MP3V5004G Freescale Semiconductor, MP3V5004G Datasheet - Page 3

• Manufacturer Part Number: MP3V5004G
• Description: Integrated Silicon Pressure Sensor On-Chip Signal Conditioned
• Manufacturer: Freescale Semiconductor

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Sensors
Freescale Semiconductor
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
chip carrier (Case 482). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
qualification test for dry air, and other media, are available
Figure 3. Recommended Power Supply Decoupling and
(For additional output filtering, please refer to Application
The performance over temperature is achieved by
Figure 2
The MP3V5004G series sensor operating characteristics
1.0 μF
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
illustrates the gauge configuration in the basic
0.01 μF
Lead Frame
Output Filtering.
Note AN1646.)
V
s
+3 V
Wire Bond
GND
IPS
V
Differential Sensing
Fluorosilicone
Gel Die Coat
out
Figure 2. Cross-Sectional Diagram (Not to Scale)
Element
470 pF
OUTPUT
P1
P2
Die
from the factory. Contact the factory for information regarding
media tolerance in your application.
interfacing the output of the MP3V5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
pressure input. Typical, minimum and maximum output
curves are shown for operation over a temperature range of
10°C to 60°C using the decoupling circuit shown in
The output will saturate outside of the specified pressure
range.
Figure 3
Figure 4
3.0
2.0
1.0
0.6
Figure 4. Output versus Pressure Differential
TRANSFER FUNCTION:
V
V
TEMP = 10 to 60°C
out
S
Steel Cap
Max
(See Note 5 in Operating Characteristics)
Stainless
= 3.0 V ± 0.30 Vdc
Die Bond
shows the recommended decoupling circuit for
shows the sensor output signal relative to
= V
Thermoplastic
S
*[(0.2*P) + 0.2] ± 2.5% V
Case
at ±2.5% V
200 mm H
2 kPa
FSS
2
FSS
Min
O
Typical
MP3V5004G
400 mm H
Figure 3
4 kPa
2
O
3