MP3V5004G Freescale Semiconductor, MP3V5004G Datasheet - Page 4

• Manufacturer Part Number: MP3V5004G
• Description: Integrated Silicon Pressure Sensor On-Chip Signal Conditioned
• Manufacturer: Freescale Semiconductor

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pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing
silicone gel which isolates the die from the environment. The
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE
MOUNTED APPLICATIONS
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
MP3V5004G
4
Freescale Semiconductor designates the two sides of the
Surface mount board layout is a critical portion of the total
MP3V5004GC6U/T1
MP3V5004GC7U
MP3V5004GP
MP3V5004DP
MP3V5004GVP
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
Part Number
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
0.060 TYP 8X
1.52
Figure 5. SOP Footprint (Case 482)
Case Type
0.100 TYP 8X
2.54
482C
482A
1369
1351
1368
0.660
16.76
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
table below.
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
The Pressure (P1) side may be identified by using the
inch
mm
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Port Marking
Stainless Steel Cap
Pressure (P1) Side Identifier
SCALE 2:1
0.100 TYP 8X
2.54
0.300
7.62
Freescale Semiconductor
Sensors