MP3V5050V Freescale Semiconductor, MP3V5050V Datasheet

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MP3V5050V

Manufacturer Part Number
MP3V5050V
Description
High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned
Manufacturer
Freescale Semiconductor
Datasheet
www.DataSheet4U.com
Freescale Semiconductor
Technical Data
High Temperature Accuracy
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration
make the Freescale Semiconductor, Inc. pressure sensor a logical and
economical choice for the system designer.
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor
processing to provide an accurate, high level analog output signal that is
proportional to applied pressure.
pressure sensor chip.
Features
Typical Applications
Sensors
Freescale Semiconductor
Ported
Element
Ported
Element
Device
Type
The MP3V5050V sensor integrates on-chip, bipolar op amp circuitry and thin
The MP3V5050V piezoresistive transducer is a state-of-the-art, monolithic,
Figure 1
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated from Over –40° to +125°C
Patented Silicon Shear Stress Strain Gauge
Durable Thermoplastic (PPS) Surface Mount Package
Easy-to-Use Chip Carrier Option
Ideal for Automotive and Non-Automotive Applications
Vacuum Pump Monitoring
Vacuum,
Axial Port
Vaccum,
Axial Port
Options
shows a block diagram of the internal circuitry integrated on a
Case
482A
482A
No.
ORDERING INFORMATION
MP3V5050VC6T1
MP3V5050VC6U
MPX Series
Order No.
Sensing
Element
Tape & Reel MP3V5050V
Packing
Options
GND
Rail
Compensation
Gain Stage #1
Temperature
Thin Film
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
and
MP3V5050V
V
Device Marking
S
Gain Stage #2
Shift Circuitry
Reference
Ground
and
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
1
2
3
4
SMALL OUTLINE PACKAGE
–50 to 0 kPa (–7.25 to 0 psi)
V
0.12 to 2.8 Volts Output
out
PRESSURE SENSOR
MP3V5050V
PIN NUMBER
MP3V5050VC6T1
V
GND
INTEGRATED
N/C
CASE 482A-01
V
OUT
Series
S
Rev 1, 10/2008
5
6
7
8
(1)
MP3V5050V
MP3V5050V
N/C
N/C
N/C
N/C
1

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MP3V5050V Summary of contents

Page 1

... On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MP3V5050V sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer ...

Page 2

... Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 8. Offset ( defined as the output voltage at the minimum rated pressure. off MP3V5050V 2 Figure 1. Fully Integrated Pressure Sensor Schematic Symbol V = 3.0 Vdc 25° ...

Page 3

... Pressure (kPa) Figure 4. Output versus Differential Pressure be transmitted to the silicon diaphragm. The MP3V5050V pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. ...

Page 4

... Transfer Function (MP3V5050VC6T1 Nominal Transfer Value: V ± (Pressure Error x Temp Multi x 0.018 Temperature Error Band 4.0 3.0 Temperature 2.0 Error Factor 1.0 0.0 NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band 1.25 1.00 0.75 0 –0.75 –1.00 – ...

Page 5

... Freescale Semiconductor solder reflow process always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 Figure 5. SOP Footprint (Case 482A) 0.100 TYP 2.54 0.300 7.62 inch mm MP3V5050V 5 ...

Page 6

... N - MP3V5050V 6 PACKAGE DIMENSIONS 0.25 (0.010 PIN 1 IDENTIFIER M CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION ...

Page 7

... Sensors Freescale Semiconductor NOTES MP3V5050V 7 ...

Page 8

... For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140 MP3V5050V Rev. 1 10/2008 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...

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