MP3V5050V Freescale Semiconductor, MP3V5050V Datasheet - Page 5

• Manufacturer Part Number: MP3V5050V
• Description: High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned
• Manufacturer: Freescale Semiconductor

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Sensors
Freescale Semiconductor
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
Surface mount board layout is a critical portion of the total
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
0.060 TYP 8X
1.52
Figure 5. SOP Footprint (Case 482A)
0.100 TYP 8X
2.54
0.660
16.76
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
inch
mm
0.100 TYP
2.54
0.300
7.62
MP3V5050V
5