EM6607 EM Microelectronic, EM6607 Datasheet - Page 47

• Manufacturer Part Number: EM6607
• Description: Ultra-low power microcontroller
• Manufacturer: EM Microelectronic

21 Ordering Information
Ordering Part Number (selected examples)
Please make sure to give the complete Part Number when ordering, including the 3-digit customer version. The customer
version is made of 3 numbers %%% (e.g. 008 , 012, 131, etc.)
21.1 Package Marking
First line:
Second line:
Third line:
First line:
Second line:
Third line:
Where: %%% or %% = customer version, specific number given by EM (e.g. 008, 012, 131, etc.)
21.2 Customer Marking
There are 11 digits available for customer marking on SO24/28, 4 for TSSOP24, and 8 for TSSOP14.
Copyright © 2005, EM Microelectronic-Marin SA
Packaged Device:
Package:
SO28 = 28 pin SOIC
SO24 = 24 pin SOIC
TP28 = 28 pin TSSOP
TP24 = 24 pin TSSOP
Delivery Form:
A = Stick
B = Tape&Reel
Customer Version:
customer-specific number
given by EM Microelectronic
Part Number
EM6607SO28A-%%%
EM6607SO28B-%%%
EM6607SO24A-%%%
EM6607SO24B-%%%
EM6607TP28B-%%%
EM6607TP24B-%%%
EM6607WS11-%%%
EM6607WP11-%%%
EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in
the Company's standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site.
EM assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or
specifications detailed herein at any time without notice, and does not make any commitment to update the information
contained herein. No licenses to patents or other intellectual property of EM are granted in connection with the sale of EM
products, expressly or by implications. EM's products are not authorized for use as components in life support devices or
systems.
PP…P = Production identification (date & lot number) of EM Microelectronic
Y = year of assembly
CC…C = Customer specific package marking on third line, selected by customer
R
24/28-pin SOIC marking:
28-pin TSSOP marking:
EM6607 SO28 A %%%
E M 6 6 0
P P P P P P P P P P P
C C C C C C C C C C C
E M 6 6 0 7
P P P P P P P P P P P
C C C C C C C C
Package/Die Form
28 pin SOIC
28 pin SOIC
24 pin SOIC
24 pin SOIC
28 pin TSSOP
24 pin TSSOP
Sawn wafer
Die in waffle pack
7
-
% % % Y
% % % Y
Delivery Form/ Thickness
Stick
Tape&Reel
Stick
Tape&Reel
Tape&Reel
Tape&Reel
11 mils
11 mils
Device in DIE Form:
EM6607
WS 11 %%%
47
-
E M 6
P P
24-pin TSSOP marking:
Die form:
WW = Wafer
WS = Sawn Wafer/Frame
WP = Waffle Pack
Thickness:
11 = 11 mils (280um), by default
27 = 27 mils (686um), not backlapped
(for other thickness, contact EM)
Customer Version:
customer-specific number
given by EM Microelectronic
© EM Microelectronic-Marin SA, 01/06, Rev. D
C C C C Y P
P P P P P P
6
0
www.emmicroelectronic.com
7 % %
EM6607