sidc24d60sic3 Infineon Technologies Corporation, sidc24d60sic3 Datasheet
sidc24d60sic3
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sidc24d60sic3 Summary of contents
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... I Die Size 1.706 x 1.38 mm suitable for epoxy and soft solder die bonding Electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC24D60SIC3 A C Package Ordering Code Q67050-A4281- sawn on foil A101 1.706x 1.38 1.405 x 1.08 2.354 / 1.548 ...
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... I R Forward voltage drop V F Dynamic Electrical Characteristics Parameter Symbol Total capacitive charge Q C Switching time Total capacitance C Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC24D60SIC3 Symbol Condition RSM = =10 ms sinusoidal 100 C, T ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC24D60SIC3 1705 1405 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC24D60SIC3 INFINEON TECHNOLOGIES SDT08S60 ...