HEF40175BT,652 NXP Semiconductors, HEF40175BT,652 Datasheet - Page 2

• Manufacturer Part Number: HEF40175BT,652
• Description: IC QUAD D-TYPE FLIP FLOP 16SOIC
• Manufacturer: NXP Semiconductors
• Series: 4000Br
• Type: D-Type Busr

Specifications of HEF40175BT,652

• Package / Case: 16-SOIC (3.9mm Width)
• Function: Master Reset
• Output Type: Differential
• Number Of Elements: 1
• Number Of Bits Per Element: 4
• Frequency - Clock: 45MHz
• Delay Time - Propagation: 25ns
• Trigger Type: Positive Edge
• Voltage - Supply: 3 V ~ 15 V
• Mounting Type: Surface Mount
• Number Of Circuits: 1
• Logic Family: HEF4000
• Logic Type: D-Type Edge Triggered Flip-Flop
• Polarity: Inverting/Non-Inverting
• Input Type: Single-Ended
• Propagation Delay Time: 25 ns at 15 V
• High Level Output Current: - 3.6 mA
• Low Level Output Current: 3.6 mA
• Supply Voltage (max): 15.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 4.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 933373470652; HEF40175BTD; HEF40175BTD

Philips Semiconductors
INDEX
Note
1. Corrected 26 June 1997.
January 1995
SO
SOT108-1
SOT109-1
SOT162-1
SOT163-1
SOT137-1
SOT136-1
SSOP
SOT337-1
SOT338-1
SOT339-1
SOT340-1
SOT341-1
DIP
SOT27-1
SOT38-1
SOT102-1
SOT146-1
SOT101-1
SOT117-1
SOT129-1
CDIP
SOT73-1
SOT74-1
SOT133-1
SOT152-2
SOT94-1
SOT135-1
Package information
PACKAGE VERSIONS
(1)
plastic small outline package; 14 leads; body width 3.9 mm
plastic small outline package; 16 leads; body width 3.9 mm
plastic small outline package; 16 leads; body width 7.5 mm
plastic small outline package; 20 leads; body width 7.5 mm
plastic small outline package; 24 leads; body width 7.5 mm
plastic small outline package; 28 leads; body width 7.5 mm
plastic shrink small outline package; 14 leads; body width 5.3 mm
plastic shrink small outline package; 16 leads; body width 5.3 mm
plastic shrink small outline package; 20 leads; body width 5.3 mm
plastic shrink small outline package; 24 leads; body width 5.3 mm
plastic shrink small outline package; 28 leads; body width 5.3 mm
plastic dual in-line package; 14 leads (300 mil)
plastic dual in-line package; 16 leads (300 mil); long body
plastic dual in-line package; 18 leads (300 mil)
plastic dual in-line package; 20 leads (300 mil)
plastic dual in-line package; 24 leads (600 mil)
plastic dual in-line package; 28 leads (600 mil)
plastic dual in-line package; 40 leads (600 mil)
ceramic dual in-line package; 14 leads; glass seal
ceramic dual in-line package; 16 leads; glass seal
ceramic dual in-line package; 18 leads; glass seal
ceramic dual in-line package; 20 leads; glass seal
ceramic dual in-line package; 24 leads; glass seal
ceramic dual in-line package; 28 leads; glass seal
2
DESCRIPTION
Package outlines
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