74ALVC574PW,112 NXP Semiconductors, 74ALVC574PW,112 Datasheet
74ALVC574PW,112
Specifications of 74ALVC574PW,112
74ALVC574PW
935269739112
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74ALVC574PW,112 Summary of contents
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Octal D-type flip-flop; positive edge-trigger; 3-state Rev. 02 — 8 November 2007 1. General description The 74ALVC574 is an octal D-type flip-flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus-oriented applications. A clock input (CP) ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74ALVC574D +85 C 74ALVC574PW +85 C 74ALVC574BQ + Functional diagram Fig 1. Logic symbol Fig 3. Functional diagram 74ALVC574_2 Product data sheet Octal D-type flip-flop; positive edge-trigger; 3-state Description SO20 plastic small outline package; 20 leads; ...
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... NXP Semiconductors FF1 FF2 Fig 4. Logic diagram 74ALVC574_2 Product data sheet Octal D-type flip-flop; positive edge-trigger; 3-state FF3 FF4 Rev. 02 — 8 November 2007 74ALVC574 FF5 FF6 FF7 Q4 Q5 © NXP B.V. 2007. All rights reserved FF8 mna801 ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning 74ALVC574 GND 001aad095 Fig 5. Pin configuration SO20 and TSSOP20 5.2 Pin description Table 2. Pin description Symbol Pin D[0: Q[0:7] 19, 18, 17, 16, 15, 14, 13 GND 10 74ALVC574_2 Product data sheet Octal D-type flip-flop; positive edge-trigger; 3-state ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Operating mode Input OE Load and read register L L Load register and disable H outputs H [ HIGH voltage level h = HIGH voltage level one set-up time prior to the LOW to HIGH CP transition L = LOW voltage level l = LOW voltage level one set-up time prior to the LOW to HIGH CP transition ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter I OFF-state output current OZ I power-off leakage current OFF I supply current CC I additional supply current CC C input capacitance I [1] All typical values are measured at V 10. Dynamic characteristics Table 7 ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter t set-up time su t hold time h f maximum frequency max C power dissipation PD capacitance [1] Typical values are measured the same as t and PHL PLH t is the same as t and t ...
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... NXP Semiconductors 11. Waveforms CP input Qn output Measurement points are given in V and V are the typical output voltage levels that occur with the output load Fig 7. Clock (CP) to output (Qn) propagation delays, the clock pulse width, and the maximum frequency Table 8. Measurement points Supply voltage ...
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... NXP Semiconductors CP input Dn input Qn output Measurement points are given in V and V are the typical output voltage levels that occur with the output load The shaded areas indicate when the input is permitted to change for predicable output performance. Fig 9. Data set-up and hold times for the Dn input to the CP input ...
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... NXP Semiconductors Test data is given in Table 9. Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance External voltage for measuring switching times. EXT Fig 10. Test circuit for switching times Table 9. Test data ...
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... NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 2.65 mm 0.25 0.1 2.25 0.012 0.096 0.1 inches 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Document ID Release date 74ALVC574_2 20071108 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section • Section • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 Revision history ...