mt4lc4m16r6 Micron Semiconductor Products, mt4lc4m16r6 Datasheet

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mt4lc4m16r6

Manufacturer Part Number
mt4lc4m16r6
Description
4 Meg X 16 Edo Dram
Manufacturer
Micron Semiconductor Products
Datasheet

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DRAM
FEATURES
• Single +3.3V ±0.3V power supply
• Industry-standard x16 pinout, timing, functions,
• 12 row, 10 column addresses (R6)
• High-performance CMOS silicon-gate process
• All inputs, outputs and clocks are LVTTL-compatible
• Extended Data-Out (EDO) PAGE MODE access
• 4,096-cycle CAS#-BEFORE-RAS# (CBR) REFRESH
• Optional self refresh (S) for low-power data
OPTIONS
• Plastic Package
• Timing
• Refresh Rates
• Operating Temperature Range
NOTE: 1. The “#” symbol indicates signal is active LOW.
*Contact factory for availability.
**Available only on MT4LC4M16R6 standard refresh device.
KEY TIMING PARAMETERS
4 Meg x 16 EDO DRAM
D29_2.p65 – Rev. 5/00
SPEED
and package
13 row, 9 column addresses (N3)
distributed across 64ms
retention
50-pin TSOP (400 mil)
50ns access
60ns access
4K
8K
Standard Refresh
Self Refresh
Commercial (0°C to +70°C)
Extended (-40°C to +85°C)
-5
-6
104ns
84ns
t
RC
MT4LC4M16R6TG-5
t
50ns
60ns
RAC
Part Number Example:
20ns
25ns
t
PC
25ns
30ns
t
AA
MARKING
t
13ns
15ns
CAC
None
None
IT**
TG
N3
R6
-5
-6
S*
t
10ns
CAS
8ns
1
MT4LC4M16R6, MT4LC4M16N3
For the latest data sheet, please refer to the Micron Web
site:
4 MEG x 16 EDO DRAM PART NUMBERS
x = speed
PART NUMBER
MT4LC4M16R6TG-x
MT4LC4M16R6TG-x S
MT4LC4M16N3TG-x
MT4LC4M16N3TG-x S
A12 for N3 version, NC for R6 version.
Configuration
Refresh
Row Address
Column Addressing
www.micronsemi.com/mti/msp/html/datasheet.html
Micron Technology, Inc., reserves the right to change products or specifications without notice.
PIN ASSIGNMENT (Top View)
RAS#
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
WE#
V
V
V
V
NC
NC
NC
NC
NC
A0
A1
A2
A3
A4
A5
CC
CC
CC
CC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50-Pin TSOP
ADDRESSING PACKAGE REFRESH
MT4LC4M16R6 MT4LC4M16N3
4K (A0-A11)
REFRESH
4 Meg x 16
1K (A0-A9)
4K
8K
4K
8K
4K
4 MEG x 16
EDO DRAM
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
400-TSOP Standard
400-TSOP
400-TSOP Standard
400-TSOP
©2000, Micron Technology, Inc.
8K (A0-A12)
512 (A0-A8)
4 Meg x 16
V
DQ15
DQ14
DQ13
DQ12
V
DQ11
DQ10
DQ9
DQ8
NC
V
CASL#
CASH#
OE#
NC
NC
NC/A12
A11
A10
A9
A8
A7
A6
V
S S
S S
S S
S S
8K
Self
Self

Related parts for mt4lc4m16r6

mt4lc4m16r6 Summary of contents

Page 1

... Self Refresh • Operating Temperature Range Commercial (0°C to +70°C) Extended (-40°C to +85°C) NOTE: 1. The “#” symbol indicates signal is active LOW. *Contact factory for availability. **Available only on MT4LC4M16R6 standard refresh device. Part Number Example: MT4LC4M16R6TG-5 KEY TIMING PARAMETERS ...

Page 2

... REFRESH CONTROLLER A0- A12 REFRESH COUNTER ROW- ADDRESS 13 BUFFERS (13) NO. 1 CLOCK RAS# GENERATOR 4 Meg x 16 EDO DRAM D29_2.p65 – Rev. 5/00 FUNCTIONAL BLOCK DIAGRAM MT4LC4M16R6 (12 row addresses) CAS# DATA-IN BUFFER 4,096 FUNCTIONAL BLOCK DIAGRAM MT4LC4M16N3 (13 row addresses) CAS# DATA-IN BUFFER 8192 2 ...

Page 3

... The device is functionally organized as 4,194,304 locations containing 16 bits each. The 4,194,304 memory locations are arranged in 4,096 rows by 1,024 columns on the MT4LC4M16R6 or 8,192 rows by 512 columns on the MT4LC4M16N3. During READ or WRITE cycles, each location is uniquely addressed via the address bits: 12 row-address bits (A0-A11) and 10 ...

Page 4

DRAM ACCESS (continued) the upper byte (DQ8-DQ15). General byte and word access timing is shown in Figures 1 and 2. A logic HIGH on WE# dictates read mode, while a logic LOW on WE# dictates write mode. During a WRITE ...

Page 5

V IH RAS CAS ADDR ROW COLUMN ( IOH DQ OPEN V IOL RAS CAS ...

Page 6

... CBR REFRESH cycles, either uniformly spaced or grouped in bursts, every 64ms. The MT4LC4M16N3 internally refreshes two rows for each CBR cycle, whereas the MT4LC4M16R6 refreshes one row for every CBR cycle. For either device, executing 4,096 CBR cycles will refresh the entire de- vice ...

Page 7

... This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. **Available only on MT4LC4M16R6 standard refresh device. + 0.3V); £ 0.3V); CC ...

Page 8

Icc OPERATING CONDITIONS AND MAXIMUM LIMITS (Notes +3.3V ±0.3V) CC PARAMETER/CONDITION STANDBY CURRENT: TTL (RAS# = CAS STANDBY CURRENT: CMOS (RAS# = CAS# ³ 0.2V; DQs may ...

Page 9

CAPACITANCE (Note: 2) PARAMETER Input Capacitance: Address pins Input Capacitance: RAS#, CAS#, WE#, OE# Input/Output Capacitance ELECTRICAL CHARACTERISTICS (Notes 10, 11, 12 CHARACTERISTICS PARAMETER Access time from column address Column-address setup ...

Page 10

AC ELECTRICAL CHARACTERISTICS (Notes 10, 11, 12 CHARACTERISTICS PARAMETER EDO-PAGE-MODE READ or WRITE cycle time EDO-PAGE-MODE READ-WRITE cycle time Access time from RAS# RAS# to column-address delay time Row address hold time RAS# ...

Page 11

... WRITE cycle. In this case, WE# is LOW and OE# is HIGH. 22. RAS#-ONLY REFRESH requires that all 8,192 rows = 2V. of the MT4LC4M16N3 or all 4,096 rows of the OH MT4LC4M16R6 be refreshed at least once every 64ms. 23. CBR REFRESH for either device requires that at t CP. least 4,096 cycles be completed every 64ms. ...

Page 12

NOTES (continued) 28. Output parameter (DQx) is referenced to corresponding CAS# input; DQ0-DQ7 by CASL# and DQ8-DQ15 by CASH#. 29. Each CASx# must meet minimum pulse width. 30. The last CASx# edge to transition HIGH. 31. Last falling CASx# edge ...

Page 13

V IH RAS CRP V CAS ASR V IH ROW ADDR WE OE TIMING PARAMETERS -5 SYMBOL MIN ...

Page 14

V IH RAS CRP CAS ASR V IH ADDR ROW IOH DQ V IOL TIMING PARAMETERS -5 SYMBOL MIN ...

Page 15

WRITE and READ-MODIFY-WRITE cycles RAS CRP V IH CAS ASR V IH ADDR ROW WE IOH DQ V IOL ...

Page 16

V IH RAS CSH t CRP V CAS RAD t ASR t RAH V IH ADDR V ROW OPEN OE# ...

Page 17

EDO-PAGE-MODE EARLY WRITE CYCLE V IH RAS CSH t CRP V IH CAS RAD t ASR t RAH V IH ADDR ROW WCS ...

Page 18

WRITE and READ-MODIFY-WRITE cycles RAS CRP CASL#/CASH RAD t ASR t RAH V IH ADDR V ROW IL WE IOH DQ V ...

Page 19

EDO-PAGE-MODE READ EARLY WRITE CYCLE V IH RAS CRP t RCD V IH CAS RAD t ASR t RAH V IH ADDR ROW WE IOH DQ OPEN ...

Page 20

V IH RAS CRP V IH CASL#/CASH ASR V IH ADDR WE OE TIMING PARAMETERS -5 SYMBOL MIN MAX ...

Page 21

V IH RAS CRP V IH CASL#/CASH ASR V IH ADDR RAS RPC CASL#/CASH ...

Page 22

V IH RAS CRP V IH CASL#/CASH ASR V IH ADDR ROW IOH DQx V IOL TIMING PARAMETERS -5 SYMBOL MIN MAX MIN ...

Page 23

RAS RPC CSR V IH CASL CASH WRP TIMING PARAMETERS -5 SYMBOL MIN MAX MIN t CHD ...

Page 24

TYP PIN #1 ID NOTE: 1. All dimensions in millimeters MAX or typical where noted. 2. Package width and length do not include mold protrusion; allowable mold protrusion is .25mm per side. 8000 S. Federal ...

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