mt47h256m8thn-3 Micron Semiconductor Products, mt47h256m8thn-3 Datasheet
mt47h256m8thn-3
Available stocks
Related parts for mt47h256m8thn-3
mt47h256m8thn-3 Summary of contents
Page 1
TwinDie™ DDR2 SDRAM MT47H512M4 – 32 Meg Banks x 2 Ranks MT47H256M8 – 16 Meg Banks x 2 Ranks For the latest component data sheet, refer to Micron’s Web site: Functionality The ...
Page 2
Table 2: Addressing Parameter Configuration Refresh count Rank address Bank address Row address Column address PDF: 09005aef8266acfe/Source: 09005aef8266ac6e MT47H512M4_32M_16M_twindie.fm - Rev. B 1/08 EN 2Gb: x4, x8 TwinDie DDR2 SDRAM 256 Meg Meg ...
Page 3
Ball Assignments and Descriptions Figure 1: 63-Ball FBGA Assignments – x4, x8 (Top View NF, DQ6 NF, DQ4 BA2 H CKE1 ...
Page 4
Table 3: 63-Ball FBGA Ball Descriptions – x4, x8 Ball Numbers Symbol H8, H3, H7, A0, A1, A2, J2, J8, J3, A3, A4, A5, J7, K2, K8, A6, A7, A8, K3, H2, A9, A10, K7, L2, A11, A12, L8 A13 ...
Page 5
Table 3: 63-Ball FBGA Ball Descriptions – x4, x8 (continued) Ball Numbers Symbol A9, C1, C3, C7 REF A3, E3, J1 A7, B2, ...
Page 6
Functional Block Diagrams Figure 2: Functional Block Diagram (32 Meg Banks x 2 Ranks) CS1# RAS# CKE1 CAS# ODT1 WE# Figure 3: Functional Block Diagram (16 Meg Banks x 2 Ranks) CS1# ...
Page 7
Electrical Specifications Stresses greater than those listed in Table 4 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions outside those indicated in the ...
Page 8
Table 5: Temperature Limits Symbol Parameter T Storage temperature STG T Operating temperature – commercial C Notes: 1. Maximum storage case temperature; T shown in Figure 4. This case temperature limit is allowed to be exceeded briefly during package reflow, ...
Page 9
I Specifications and Conditions CDD Table 7: DDR2 I Specifications and Conditions CDD Notes: 1–7 apply to the entire document; notes appear on page 10 Parameter/Condition Operating one bank active-precharge current ...
Page 10
Table 7: DDR2 I Specifications and Conditions (continued) CDD Notes: 1–7 apply to the entire document; notes appear on page 10 Parameter/Condition Operating burst read current: All banks open; Continuous burst reads 0mA OUT t ...
Page 11
Package Dimensions Figure 5: 63-Ball FBGA Package Dimensions Seating plane A 0.10 A 63X ∅0.45 Dimensions apply to solder balls post-reflow. The pre-reflow diameter is Ø0. Ø0.33 NSMD ball pad. Ball A9 8.00 4.00 3.20 Notes: 1. All ...