tda7519 STMicroelectronics, tda7519 Datasheet - Page 5

• Manufacturer Part Number: tda7519
• Description: Multichip Module For Car-radio Applications
• Manufacturer: STMicroelectronics

TDA7519
3
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 2.
DIM.
ccc
D1
D3
A1
A2
E1
E3
L1
C
D
A
B
E
e
L
k
LQFP44 (10x10) Mechanical data and package dimensions.
11.80
11.80
MIN.
0.05
1.35
0.30
0.09
9.80
9.80
0.45
12.00
10.00
12.00
10.00
TYP.
mm
1.40
0.37
8.00
8.00
0.80
0.60
1.00
0˚(min.), 3.5˚(typ.), 7˚(max.)
MAX.
12.20
10.20
12.20
10.20
1.60
0.15
1.45
0.45
0.20
0.75
0.10
0.002
0.053
0.012
0.004
0.464
0.386
0.464
0.386
0.018
MIN.
0.055
0.015
0.472
0.394
0.315
0.472
0.394
0.315
0.031
0.024
0.039
inch
TYP.
0.0039
MAX.
0.063
0.006
0.057
0.018
0.008
0.480
0.401
0.480
0.401
0.030
LQFP44 (10 x 10 x 1.4mm)
MECHANICAL DATA
OUTLINE AND
Package information
0076922 E
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