pcf8531 NXP Semiconductors, pcf8531 Datasheet - Page 36

• Manufacturer Part Number: pcf8531
• Description: 34 X 128 Pixel Matrix Driver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Table 11 Bonding pads
Table 12 Alignment marks
2000 Feb 11
handbook, full pagewidth
R11
R9
R7
R5
R3
R1
Pad pitch
Pad size; Al
Bump dimensions
Wafer thickness (excluding
bumps)
C1
C2
F
Circle 1
Circle 2
SYMBOL
34
y
128 pixel matrix driver
MARKS
center
PAD
PAD
243
244
245
246
247
248
x
circle
center
min. 70
62
50
381
+5553.6
+5623.6
+5693.6
+5763.6
+5833.6
+5903.6
+5292.4
+5890.3
+5637.4
5402.0
5543.0
100
90
x
x
100
SIZE
m
17.5 ( 5)
Fig.27 Shapes of recognition pattern.
y
center
+823.1
+823.4
+401.9
+798.4
+798.4
821.7
821.7
821.7
821.7
821.7
821.7
y
y
UNIT
m
m
m
m
36
x
100 m
center
handbook, halfpage
C
1.96
mm
y
100
m
x
Fig.26 Bonding pads.
y
center
PCF8531
12.23 mm
x
80 m
center
pitch
F
Product specification
PCF8531
MGS490
100
MGS487
m