tda8742 NXP Semiconductors, tda8742 Datasheet

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tda8742

Manufacturer Part Number
tda8742
Description
Satellite Sound Circuit With Noise Reduction
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
Product specification
Supersedes data of November 1992
File under Integrated Circuits, IC02
DATA SHEET
TDA8742; TDA8742H
Satellite sound circuit with noise
reduction
INTEGRATED CIRCUITS
October 1994

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tda8742 Summary of contents

Page 1

... DATA SHEET TDA8742; TDA8742H Satellite sound circuit with noise reduction Product specification Supersedes data of November 1992 File under Integrated Circuits, IC02 Philips Semiconductors INTEGRATED CIRCUITS October 1994 ...

Page 2

... October 1994 TDA8742; TDA8742H APPLICATIONS Satellite receivers TV sets Video recorders. GENERAL DESCRIPTION The TDA8742; TDA8742H is a multi-function sound IC for use in satellite receivers, television sets and video recorders. The pin numbers given in parenthesis throughout this document refer to the QFP44 package. CONDITIONS MIN. 8 S/N( ...

Page 3

... BLOCK DIAGRAM The pin numbers in parenthesis refer to the QFP44 package. October 1994 PACKAGE DESCRIPTION plastic shrink dual in-line package; 42 leads (600 mil) plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 10 1.75 mm Fig.1 Block diagram. 3 Product specification TDA8742; TDA8742H VERSION SOT270-1 SOT307-2 ...

Page 4

... AF section 31 audio pass-through capacitor input for left channel 32 fixed de-emphasis capacitor (left) 33 noise reduction de-emphasis capacitor (left) 34 rectifier DC decoupling (left) 35 attack/recovery capacitor (left) 4 Product specification TDA8742; TDA8742H DESCRIPTION ...

Page 5

... Satellite sound circuit with noise reduction PIN SYMBOL SDIP42 QFP44 n.c. n.c. October 1994 PIN 36 DC decoupling capacitor (left decoupling capacitor (main decoupling capacitor (right) 12 not connected 44 not connected Fig.2 Pin configuration (SDIP42). 5 Product specification TDA8742; TDA8742H DESCRIPTION ...

Page 6

... Philips Semiconductors Satellite sound circuit with noise reduction October 1994 Fig.3 Pin configuration (QFP44). 6 Product specification TDA8742; TDA8742H ...

Page 7

... These secondary carrier frequencies can be in the range of 6.30 to 8.28 MHz. The TDA8742; H contains all circuitry for processing the main channel and for two secondary channels, from baseband signal to line (SCART) output drivers. The desired frequencies can be routed to the device via bandpass filters ...

Page 8

... Output level of all channels = 6 dBV typical when frequency deviation of FM signal is 54% of maximum frequency deviation (i.e. 0.54 85 kHz = 46 kHz for the main channel and 0.54 50 kHz = 27 kHz for the secondary channels kHz modulation frequency (reference level). October 1994 TDA8742; TDA8742H ABBREVIATIONS f = modulating frequency. MOD f = frequency deviation of the main Channel frequency deviation of secondary Channel 1 (left) ...

Page 9

... CDCL,CDCR V voltage on pin 41 (37) CDCM I input current at pin 18 (14) IN3 October 1994 CONDITIONS note 1 note 2 note 2 note 1 PARAMETER = 6.5 MHz 10.52 MHz OS1 PARAMETER 9 Product specification TDA8742; TDA8742H MIN. MAX. UNIT 0 13 +150 C 20 +70 ...

Page 10

... MCS = logic 1; note 1 all PLLs locked output selector in position 4 all PLLs locked A-weighted; all PLLs locked no de-emphasis connected note 2 output selector in position 100 mV Product specification TDA8742; TDA8742H = amb = 10.52 MHz; OS1 MIN. TYP. MAX. 1.0 2.0 200 15 6.5 10.7 5.5 7 ...

Page 11

... October 1994 PARAMETER CONDITIONS S/N( note 3 pins to be left open-circuit note 4 note 4 note 4 A-weighted; note 4 note 4 output selector in position 6; note 4 note 5 note 6 all PLLs locked 100 mV Product specification TDA8742; TDA8742H MIN. TYP. MAX. 0.8 1.5 200 260 330 380 10.7 10.52 10 11.5 0 0.68 2 1.9 2.3 2 ...

Page 12

... fixed de-emphasis connected V EXTR, EXTL V EXTR, EXTL kHz i A-weighted; V EXTR, EXTL kHz i connected Product specification TDA8742; TDA8742H MIN. TYP. MAX kHz kHz kHz kHz ...

Page 13

... Modulation of main channel is ON; modulation of secondary channels is OFF. 7. Measured at pins 38 (34) (left) and 30 (26) (right) and no electrolytic capacitors connected to these pins. October 1994 PARAMETER CONDITIONS V must be 1 +70 C. amb 13 Product specification TDA8742; TDA8742H MIN. TYP. MAX. UNIT 0 1.2 V 1.8 2 3.5 V ...

Page 14

... X = don’t care. October 1994 STATE PIN 15 (10) PIN 17 (13) OUTSEL L OUTSEL Product specification TDA8742; TDA8742H PIN 3 (41) PIN 5 (43 PIN 26 (22) PIN 13 (8) EXT/INT MUTE ...

Page 15

... Philips Semiconductors Satellite sound circuit with noise reduction October 1994 TDA8742; TDA8742H 15 Product specification ...

Page 16

... A normal signal will be processed using 150 kHz filters thus resulting in a signal with normal distortion. For the main channel either baseband or synthesized signal can be selected. The circuit is illustrated in Fig.5. October 1994 TDA8742; TDA8742H 16 Product specification ...

Page 17

... Philips Semiconductors Satellite sound circuit with noise reduction October 1994 TDA8742; TDA8742H 17 Product specification ...

Page 18

... Satellite sound circuit with noise reduction PACKAGE OUTLINES handbook, full pagewidth 3.2 2.9 1.73 max 42 1 Dimensions in mm. Fig.6 Plastic shrink dual in-line package; 42 leads (600 mil); SDIP42; SOT270-1. October 1994 39.0 38.4 0.53 1.778 max (40x) 1.3 max Product specification TDA8742; TDA8742H 15.80 15.24 4.57 5.08 max max 0.51 min 0.32 max 0.18 M 15.24 17.15 15.90 MSA268 - 1 14.1 13.7 ...

Page 19

... Dimensions in mm. Fig.7 Plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 October 1994 S 0.1 S 12.9 12.3 1.2 (4x) 0 0.8 0.40 23 0.20 22 1.2 (4x) 0. 0.8 10.1 9.9 A 1.85 1.65 0.25 0.05 detail X MBB944 - 2 19 Product specification TDA8742; TDA8742H B 10.1 12.9 9.9 12.3 X 0.85 0.75 2.10 0.25 1.70 0. 0.95 0.55 10 1.75 mm (QFP44; SOT307-2). ...

Page 20

... Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. October 1994 TDA8742; TDA8742H B Y SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement ...

Page 21

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. October 1994 TDA8742; TDA8742H 21 Product specification ...

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