tda8932btw-n2 NXP Semiconductors, tda8932btw-n2 Datasheet - Page 42

• Manufacturer Part Number: tda8932btw-n2
• Description: Tda8932b Class-d Audio Amplifier
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Fig 41. Package outline SOT549-1 (HTSSOP32)
TDA8932B_3
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
0
Rev. 03— 21 June 2007
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
EUROPEAN
detail X
0.2
v
L
Class-D audio amplifier
L
0.1
p
w
© NXP B.V. 21 June 2007. All rights reserved.
TDA8932B
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
X
Z
SOT549-1
A
v
M
8
0
o
42 of 48
o
A