mm908e622 Freescale Semiconductor, Inc, mm908e622 Datasheet - Page 61

• Manufacturer Part Number: mm908e622
• Description: Mm908e622 Integrated Quad Half-bridge, Triple High-side And Ec Glass Driver With Embedded Mcu And Lin For High End Mirror
• Manufacturer: Freescale Semiconductor, Inc

Device on Thermal Test Board
Analog Integrated Circuit Device Data
Freescale Semiconductor
(PTD0/TACH0/BEMF -> PWM)
Material:
Outline:
Area A:
Ambient Conditions:
PTD1/TACH1
PTC2/MCLK
PTC4/OSC1
PTC3/OSC2
TESTMODE
908E622 Terminal Connections
PTB5/AD5
PTB4/AD4
PTB3/AD3
10.3 mm x 5.1 mm Exposed Pad
A0CST
VSUP1
VSUP2
VSUP3
RST_A
IRQ_A
GND1
GND2
GND3
ECR
HB4
HB3
HB2
RST
IRQ
LIN
EC
A0
17.9 mm x 7.5 mm Body
54-Terminal SOICW-EP
0.65 mm Pitch
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for
thermal testing
Cu heat-spreading areas on board
surface
Natural convection, still air
Exposed
Pad
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
PTA0/KBD0
PTA1/KBD1
PTA2/KBD2
FLSVPP
PTA3/KBD3
PTA4/KBD4
VDDA/VREFH
EVDD
EVSS
VSSA/VREFL
(PTE1/RXD <- RXD)
VSS
VDD
HVDD
L0
H0
HS3
VSUP8
HS2
VSUP7
HS1b
HS1a
VSUP6
VSUP5
GND4
HB1
VSUP4
Figure 37. Thermal Test Board
Table 25. Thermal Resistance Performance
ambient air.
the reference location on the board surface near a center
lead of the package. This device is a dual die package. Index
m indicates the die that is heated. Index n refers to the
number of the die where the junction temperature is sensed.
Resistance
R
R
Thermal
R
R
θ
θ
JAmn
JSmn
θ JA
θ JSmn
is the thermal resistance between die junction and
is the thermal resistance between die junction and
Area A
(mm
300
600
300
600
0
0
2
A
A
)
1 = Power Chip, 2 = Logic Chip
m = 1,
n = 1
53
39
35
21
15
14
m = 1, n = 2
m = 2, n = 1
9.0
Additional Information
48
34
30
16
11
Thermal Addendum
m = 2,
n = 2
(°C/W)
908E622
53
38
34
20
15
13
61