mpc8314e Freescale Semiconductor, Inc, mpc8314e Datasheet - Page 101

no-image

mpc8314e

Manufacturer Part Number
mpc8314e
Description
Powerquicc Ii Pro Processor Hardware Specifications
Manufacturer
Freescale Semiconductor, Inc
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
mpc8314eCVRADDA
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
mpc8314eCVRADDA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
mpc8314eCVRAFDA
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
mpc8314eCVRAFDA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
mpc8314eCVRAGDA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
mpc8314eCVRAGDA
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
mpc8314eVRADDA
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
mpc8314eVRADDA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
mpc8314eVRAFDA
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
mpc8314eVRAFDA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
mpc8314eVRAGDA
Manufacturer:
FREESCALE
Quantity:
20 000
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb force (45
Newtons). If an adhesive attachment is planned, the adhesive should be intended for attachment to painted
or plastic surfaces and its performance verified under the application requirements.
24.3.1
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink temperature and
then back calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction to case
thermal resistance.
25 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8314E.
25.1
The MPC8314E includes two PLLs.
25.2
Each of the PLLs listed above is provided with power through independent power supply pins
(AVDD1,AVDD2 respectively). The AV
these voltages are derived directly from VDD through a low frequency filter scheme such as the following.
Freescale Semiconductor
1. The platform PLL (AVDD2) generates the platform clock from the externally supplied
2. The e300 Core PLL (AVDD1
SYS_CLKIN input. The frequency ratio between the platform and SYS_CLKIN is selected using
the platform PLL ratio configuration bits as described in
Configuration.”
frequency ratio between the e300 core clock and the platform clock is selected using the e300
PLL ratio configuration bits as described in
System Clocking
PLL Power Supply Filtering
Experimental Determination of the Junction Temperature with a
Heat Sink
Where
MPC8314E PowerQUICC
T
T
R
P
D
J
C
θ
JC
= T
is the case temperature of the package
is the power dissipation
is the junction-to-case thermal resistance
C
+ (R
θ
)
JC
generates the core clock as a slave to the platform clock. The
DD
x P
II Pro Processor Hardware Specifications, Rev. 0
D
level should always be equivalent to VDD, and preferably
)
Section 23.2, “Core PLL Configuration.”
Section 23.1, “System PLL
System Design Information
101

Related parts for mpc8314e