mpc8314e Freescale Semiconductor, Inc, mpc8314e Datasheet - Page 75

• Manufacturer Part Number: mpc8314e
• Description: Powerquicc Ii Pro Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

Figure 58
22 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8314E is available in
a thermally enhanced plastic ball grid array (TEPBGA II), see
MPC8314E TEPBGA II,”
on the TEPBGA II.
22.1
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm,
TEPBGA II.
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder balls
Ball diameter (typical)
Package Parameters for the MPC8314E TEPBGA II
TDMxTFS (output)
shows the TDM transmit signal timing.
TDMxTFS (input)
TDMxRCK
TDMxTCK
TDMxTD
MPC8314E PowerQUICC
t
DMIVKH
and
Section 22.2, “Mechanical Dimensions of the TEPBGA II,”
Figure 58. TDM Transmit Signals
t
DM_OUTAC
t
DMTKHOV
™
II Pro Processor Hardware Specifications, Rev. 0
t
DM_HIGH
t
DMFSIXKH
29 mm × 29 mm
620
1 mm
2.23 mm
96.5 Sn/3.5 Ag (VR package)
0.6 mm
t
DMFSKHOV
t
DM
t
DM_LOW
Section 22.1, “Package Parameters for the
t
DM_OUTHI
t
DMTKHOX
Package and Pin Listings
t
DMFSKHOX
for information
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